Inventor

TIEN CANDY

TW3 patents

Patents

3 patents

US6246115B1Jun 12, 2001

Semiconductor package having a heat sink with an exposed surface

SILICONWARE PRECISION INDUSTRIES CO LTD170 citations97

US6552428B1Apr 22, 2003

Semiconductor package having an exposed heat spreader

SILICONWARE PRECISION INDUSTRIES CO LTD168 citations96

US6650015B2Nov 18, 2003

Cavity-down ball grid array package with semiconductor chip solder ball

SILICONWARE PRECISION INDUSTRIES CO LTD12 citations68