Inventor

IKEMURA KAZUHIRO

JP15 patents

⚠️ This page may combine multiple inventors who share the name “IKEMURA KAZUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NITTO DENKO CORP

11 patents

US7262514B2Aug 28, 2007

Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device

NITTO DENKO CORP25 citations92

US7064011B2Jun 20, 2006

Semiconductor device fabricating apparatus and semiconductor device fabricating method

NITTO DENKO CORP21 citations91

US5565709AOct 15, 1996

Semiconductor device

NITTO DENKO CORP27 citations91

US7132755B2Nov 7, 2006

Adhesive film for manufacturing semiconductor device

NITTO DENKO CORP11 citations83

US6248454B1Jun 19, 2001

Epoxy resin composition for semiconductor encapsulation and semiconductor device

NITTO DENKO CORP17 citations83

US5976916ANov 2, 1999

Method of producing semiconductor device and encapsulating pellet employed therein

NITTO DENKO CORP18 citations83

US5294835AMar 15, 1994

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

NITTO DENKO CORP18 citations71

US7501711B2Mar 10, 2009

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

NITTO DENKO CORP7 citations70

US7265167B2Sep 4, 2007

Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same

NITTO DENKO CORP2 citations61

US6410615B1Jun 25, 2002

Semiconductor sealing epoxy resin composition and semiconductor device using the same

NITTO DENKO CORP5 citations61

US7268191B2Sep 11, 2007

Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby

NITTO DENKO CORP0 citations50

DAINIPPON PRINTING CO LTD

3 patents

US7365441B2Apr 29, 2008

Semiconductor device fabricating apparatus and semiconductor device fabricating method

DAINIPPON PRINTING CO LTD15 citations82

US8018044B2Sep 13, 2011

Semiconductor device, substrate for producing semiconductor device and method of producing them

DAINIPPON PRINTING CO LTD3 citations61

US7943427B2May 17, 2011

Semiconductor device, substrate for producing semiconductor device and method of producing them

DAINIPPON PRINTING CO LTD0 citations40

IKENAGA CHIKAO

1 patent

US8525351B2Sep 3, 2013

Semiconductor device, substrate for producing semiconductor device and method of producing them

IKENAGA CHIKAO0 citations48