Inventor
NARITA SHORIKI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “NARITA SHORIKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
22 patentsUS7353596B2Apr 8, 2008
Component mounting method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD180 citations97
US7014092B2Mar 21, 2006
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations92
US6302317B1Oct 16, 2001
Bump bonding apparatus and method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD28 citations92
US6098868AAug 8, 2000
Bump forming method and bump bonder
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD23 citations91
US5769236AJun 23, 1998
Component collective and component collective feeding apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD22 citations91
US7350289B2Apr 1, 2008
Component feeding head apparatus, for holding a component arrayed
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9 citations79
US6568580B2May 27, 2003
Bump bonding apparatus and method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations74
US6494358B2Dec 17, 2002
Bump bonding apparatus and method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD10 citations74
US6329640B1Dec 11, 2001
Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD13 citations74
US7052984B2May 30, 2006
Bump formation method and bump forming apparatus for semiconductor wafer
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations73
US6910613B2Jun 28, 2005
Device and method for forming bump
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations73
US5931282AAug 3, 1999
Component collective and component collective feeding apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD15 citations72
US5955876ASep 21, 1999
Board positioning apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD14 citations71
US5648729AJul 15, 1997
Board positioning method and apparatus of the methods
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9 citations71
US7306551B2Dec 11, 2007
Tool exchange device and tool
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations63
US6392202B2May 21, 2002
Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations63
US7387229B2Jun 17, 2008
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62
US7350684B2Apr 1, 2008
Apparatus and method for forming bump
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations62
US7031509B2Apr 18, 2006
Method and apparatus for correcting inclination of IC on semiconductor wafer
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations62
US7005368B1Feb 28, 2006
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations62
US6787391B1Sep 7, 2004
Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations62
US6818975B1Nov 16, 2004
Electric charge generating semiconductor substrate bump forming device, method of removing electric charge from electric charge generating semiconductor substrate device for removing electric charge from electric charge generating semiconductor substrate, and electric charge generating semiconductor substrate
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations51
PANASONIC CORP
7 patentsUS7797820B2Sep 21, 2010
Component mounting apparatus
PANASONIC CORP178 citations97
US7650691B2Jan 26, 2010
Component supply head device and component mounting head device
PANASONIC CORP10 citations84
US7731469B2Jun 8, 2010
Component feeder
PANASONIC CORP7 citations73
US7806642B2Oct 5, 2010
Receiver for component feed plates and component feeder
PANASONIC CORP4 citations63
US7452315B2Nov 18, 2008
Tool exchange device and tool
PANASONIC CORP2 citations63
US7516878B2Apr 14, 2009
Bump formation method and bump forming apparatus for semiconductor wafer
PANASONIC CORP2 citations62
US7552528B2Jun 30, 2009
Wafer expanding device, component feeder, and expanding method for wafer sheet
PANASONIC CORP0 citations39