Inventor
BAI SIPING
CN7 patents
Patents
7 patentsUS10321581B2Jun 11, 2019
Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
RICHVIEW ELECTRONICS CO LTD4 citations81
US11917768B2Feb 27, 2024
Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
RICHVIEW ELECTRONICS CO LTD0 citations59
US11266027B2Mar 1, 2022
Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
RICHVIEW ELECTRONICS CO LTD0 citations59
US11032915B2Jun 8, 2021
Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
RICHVIEW ELECTRONICS CO LTD0 citations59
US11552617B2Jan 10, 2023
Microwave dielectric component and manufacturing method thereof
RICHVIEW ELECTRONICS CO LTD0 citations56
US10757821B2Aug 25, 2020
Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
RICHVIEW ELECTRONICS CO LTD0 citations49
US10757820B2Aug 25, 2020
Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
RICHVIEW ELECTRONICS CO LTD0 citations49