Inventor
OSTRANDER STEVEN PAUL
US9 patents
⚠️ This page may combine multiple inventors who share the name “OSTRANDER STEVEN PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS5813870ASep 29, 1998
Selectively filled adhesives for semiconductor chip interconnection and encapsulation
IBM55 citations94
US6197222B1Mar 6, 2001
Lead free conductive composites for electrical interconnections
IBM22 citations92
US5866044AFeb 2, 1999
Lead free conductive composites for electrical interconnections
IBM32 citations92
US11308257B1Apr 19, 2022
Stacked via rivets in chip hotspots
IBM2 citations71
US11882645B2Jan 23, 2024
Multi chip hardware security module
IBM0 citations61
US11239183B2Feb 1, 2022
Mitigating thermal-mechanical strain and warpage of an organic laminate substrate
IBM0 citations61
US12504747B2Dec 23, 2025
Multicomponent module design and fabrication
IBM0 citations56