Inventor

MAYDAN DAN

US103 patents

⚠️ This page may combine multiple inventors who share the name “MAYDAN DAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAYDAN DAN

APPLIED MATERIALS INC

Optical ready substrates

Deposition of film layers by alternately pulsing a precursor and high frequency power in a continuous gas flow

Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process

Electrostatic chuck having improved gas conduits

High frequency semiconductor wafer processing apparatus and method

High-frequency semiconductor wafer processing apparatus and method

Plasma-enhanced CVD process using TEOS for depositing silicon oxide

Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process

Staged-vacuum wafer processing system and method

Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process

Multistep planarized chemical vapor deposition process with the use of low melting inorganic material for flowing while depositing

Process for PECVD of silicon oxide using TEOS decomposition

CVD of silicon oxide using TEOS decomposition and in-situ planarization process

Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films

Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition

Optical ready wafers

Electrostatic chuck having composite dielectric layer and method of manufacture

Electroplating apparatus using a perforated phosphorus doped consumable anode

Symmetric tunable inductively coupled HDP-CVD reactor

Remote plasma source for chamber cleaning

Gas injection slit nozzle for a plasma process reactor

Multiple chamber integrated process system

Ultra high throughput wafer vacuum processing system

Gas injection slit nozzle for a plasma process reactor

Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck

Gas injection slit nozzle for a plasma process reactor

UHF/VHF plasma for use in forming integrated circuit structures on semiconductor wafers

Multichamber integrated process system

Magnetic field-enhanced plasma etch reactor

VHF/UHF reactor system

Multi-chamber integrated process system

Magnetic field-enhanced plasma etch reactor

Fabrication of silicon-on-insulator structure using plasma immersion ion implantation

Dielectric covered electrostatic chuck

Process for PECVD of silicon oxide using TEOS decomposition

PECVD of compounds of silicon from silane and nitrogen

Bomine and iodine etch process for silicon and silicides

Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck

Method for protecting against deposition on a selected region of a substrate

Apparatus for preventing deposition gases from contacting a selected region of a substrate during deposition processing

Plasma CVD of silicon nitride thin films on large area glass substrates at high deposition rates

Method for planarizing an integrated circuit structure using low melting inorganic material

Wafer heating and monitor module and method of operation

Laser interferometer system and method for monitoring and controlling IC processing

Materials and methods for plasma etching of aluminum and aluminum alloys

Materials and methods for plasma etching of oxides and nitrides of silicon

APPLIED KOMATSU TECHNOLOGY INC

Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology

Deposition chamber cleaning technique using a high power remote excitation source

SUNPOWER CORP

Shingled solar cell module

(unassigned)

Monitoring dimensions of features at different locations in the processing of substrates