Inventor
OKUHAMA YOSHIAKI
JP11 patents
⚠️ This page may combine multiple inventors who share the name “OKUHAMA YOSHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DAIWA FINE CHEMICALS CO LTD
5 patentsUS6183545B1Feb 6, 2001
Aqueous solutions for obtaining metals by reductive deposition
DAIWA FINE CHEMICALS CO LTD142 citations95
US5618404AApr 8, 1997
Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use
DAIWA FINE CHEMICALS CO LTD29 citations92
US6235093B1May 22, 2001
Aqueous solutions for obtaining noble metals by chemical reductive deposition
DAIWA FINE CHEMICALS CO LTD47 citations91
US7166152B2Jan 23, 2007
Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method
DAIWA FINE CHEMICALS CO LTD13 citations81
US7056448B2Jun 6, 2006
Method for forming circuit pattern
DAIWA FINE CHEMICALS CO LTD6 citations59