Inventor
TANAKA TAKEKAZU
JP14 patents
⚠️ This page may combine multiple inventors who share the name “TANAKA TAKEKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC ELECTRONICS CORP
10 patentsUS7138673B2Nov 21, 2006
Semiconductor package having encapsulated chip attached to a mounting plate
NEC ELECTRONICS CORP19 citations91
US7449370B2Nov 11, 2008
Production process for manufacturing such semiconductor package
NEC ELECTRONICS CORP9 citations82
US7791198B2Sep 7, 2010
Semiconductor device including a coupling region which includes layers of aluminum and copper alloys
NEC ELECTRONICS CORP4 citations73
US7224045B2May 29, 2007
Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
NEC ELECTRONICS CORP8 citations70
US7772031B2Aug 10, 2010
Semiconductor apparatus manufacturing method
NEC ELECTRONICS CORP3 citations62
US7189599B2Mar 13, 2007
Lead frame, semiconductor device using the same and method of producing the semiconductor device
NEC ELECTRONICS CORP3 citations61
US7820489B2Oct 26, 2010
Method of manufacturing semiconductor apparatus
NEC ELECTRONICS CORP0 citations51
US7550829B2Jun 23, 2009
Electronic package and semiconductor device using the same
NEC ELECTRONICS CORP1 citations51
US7274090B2Sep 25, 2007
Electronic package and semiconductor device using the same
NEC ELECTRONICS CORP1 citations51
US7723837B2May 25, 2010
Semiconductor device
NEC ELECTRONICS CORP0 citations41
TANAKA TAKEKAZU
3 patentsUS8395261B2Mar 12, 2013
Semiconductor device
TANAKA TAKEKAZU6 citations82
US8299620B2Oct 30, 2012
Semiconductor device with welded leads and method of manufacturing the same
TANAKA TAKEKAZU6 citations71
US8334596B2Dec 18, 2012
Semiconductor device including coupling ball with layers of aluminum and copper alloys
TANAKA TAKEKAZU0 citations50