Inventor
FU MEI-HUI
TW12 patents
⚠️ This page may combine multiple inventors who share the name “FU MEI-HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS9831183B2Nov 28, 2017
Contact structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD493 citations98
US10847411B2Nov 24, 2020
Conductive feature formation and structure
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations84
US9589892B2Mar 7, 2017
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10756017B2Aug 25, 2020
Contact structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10475702B2Nov 12, 2019
Conductive feature formation and structure using bottom-up filling deposition
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12482705B2Nov 25, 2025
Conductive feature formation and structure using bottom-up filling deposition
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11532503B2Dec 20, 2022
Conductive feature structure including a blocking region
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10943823B2Mar 9, 2021
Conductive feature formation and structure using bottom-up filling deposition
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11482495B2Oct 25, 2022
Semiconductor arrangement and method for making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10804140B2Oct 13, 2020
Interconnect formation and structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10269713B2Apr 23, 2019
Contact structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51