Inventor · disambiguated record
Joeri De Vos
Also filed as: DE VOS JOERI
5 granted patents·1 pending application·38 citations·filing 2011–2023
76Inventor score
Top patents by PatentIndex Score
6 records- 0191US11769750B2Substrate, assembly and method for wafer-to-wafer hybrid bondingIMEC VZW·Filed 2021·Granted Sep 26, 2023·2 cites·5 claims
- 0286US10170450B2Method for bonding and interconnecting integrated circuit devicesIMEC VZW·Filed 2017·Granted Jan 1, 2019·6 cites·11 claims
- 0384US8530264B2Methods for manufacturing arrays for CMOS imagersDE MUNCK KOEN·Filed 2011·Granted Sep 10, 2013·17 cites·20 claims
- 0483US8493736B2Device for cooling integrated circuitsOPRINS HERMAN·Filed 2011·Granted Jul 23, 2013·13 cites·11 claims
- 0550US2025125291A1Semiconductor product and method for manufacturing a semiconductor productMICLEDI MICRODISPLAYS BV·Filed 2023·Application pending·0 cites
- 0638US10066303B2Thin NiB or CoB capping layer for non-noble metallic bonding landing padsIMEC VZW·Filed 2015·Granted Sep 4, 2018·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →