P

Inventor

UCHIDA SHINICHI

JP77 patents
⚠️ This page may combine multiple inventors who share the name “UCHIDA SHINICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RENESAS ELECTRONICS CORP

16 patents
US7999386B2Aug 16, 2011

Semiconductor device including a guard ring surrounding an inductor

RENESAS ELECTRONICS CORP22 citations93
US7932578B2Apr 26, 2011

Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure

RENESAS ELECTRONICS CORP22 citations93
US8686540B2Apr 1, 2014

Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure

RENESAS ELECTRONICS CORP5 citations84
US10115684B2Oct 30, 2018

Semiconductor device

RENESAS ELECTRONICS CORP6 citations83
US9589887B2Mar 7, 2017

Semiconductor device

RENESAS ELECTRONICS CORP7 citations83
US8907460B2Dec 9, 2014

Semiconductor device

RENESAS ELECTRONICS CORP6 citations82
US10818591B2Oct 27, 2020

Semiconductor device with inductive coupling and method of manufacturing the same

RENESAS ELECTRONICS CORP3 citations73
US10446485B2Oct 15, 2019

Semiconductor device, electronic circuit having the same, and semiconductor device forming method

RENESAS ELECTRONICS CORP3 citations73
US9536828B2Jan 3, 2017

Semiconductor device

RENESAS ELECTRONICS CORP3 citations72
US10103773B2Oct 16, 2018

Semiconductor device and communication circuit

RENESAS ELECTRONICS CORP2 citations71
US9558967B2Jan 31, 2017

Method of manufacturing semiconductor device

RENESAS ELECTRONICS CORP3 citations71
US11901288B2Feb 13, 2024

Semiconductor device and method of manufacturing the same

RENESAS ELECTRONICS CORP0 citations63
US11276640B2Mar 15, 2022

Semiconductor device, electronic circuit having the same, and semiconductor device forming method

RENESAS ELECTRONICS CORP0 citations63
US10991653B2Apr 27, 2021

Semiconductor device and method of manufacturing the same

RENESAS ELECTRONICS CORP1 citations63
US9029982B2May 12, 2015

Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure

RENESAS ELECTRONICS CORP2 citations63
US11756881B2Sep 12, 2023

Semiconductor device

RENESAS ELECTRONICS CORP0 citations62

SUMITOMO WIRING SYSTEMS

11 patents

NIPPON CATALYTIC CHEM IND

6 patents

UCHIDA SHINICHI

4 patents

DEXERIALS CORP

4 patents

KYOCERA MITA CORP

3 patents

NEC ELECTRONICS CORP

2 patents

NOK CORP

1 patent

KYOCERA CORP

1 patent

KYOWA HAKKO KIRIN CO LTD

1 patent

UNIV TOKYO

1 patent

Showing the top 50 of 77 patents by PatentIndex Score.