Inventor

FORSTER JOHN C

US79 patents

⚠️ This page may combine multiple inventors who share the name “FORSTER JOHN C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FORSTER JOHN C

APPLIED MATERIALS INC

Inductive plasma loop enhancing magnetron sputtering

Darkspace shield for improved RF transmission in inductively coupled plasma sources for sputter deposition

End point detection for sputtering and resputtering

Self-ionized and capacitively-coupled plasma for sputtering and resputtering

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

Method of depositing a TaN seed layer

Method of depositing a copper seed layer which promotes improved feature surface coverage

Apparatus and method for sputtering ionized material in a plasma

Feedthrough overlap coil

Method and apparatus for performing high pressure physical vapor deposition

Method of depositing a copper seed layer which promotes improved feature surface coverage

Sputtering chamber shield promoting reliable plasma ignition

Use of variable impedance to control coil sputter distribution

Recessed coil for generating a plasma

Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system

Target sidewall design to reduce particle generation during magnetron sputtering

Apparatus for sputtering ionized material in a medium to high density plasma

Modulated power for ionized metal plasma deposition

Symmetric plasma source to generate pie shaped treatment

Multi-step process for forming a metal barrier in a sputter reactor

Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system

Method and apparatus for controlling darkspace gap in a chamber

Cleaning of sin with CCP plasma or RPS clean

Metal / metal nitride barrier layer for semiconductor device applications

Method and apparatus for forming a barrier layer on a substrate

Method and apparatus for forming a uniform layer on a workpiece during sputtering

Rounded overlap coil

Squared overlap coil

Plasma source for rotating susceptor

Shaped electrodes for improved plasma exposure from vertical plasma source

Methods and apparatus for reducing sputtering of a grounded shield in a process chamber

Self-ionized and inductively-coupled plasma for sputtering and resputtering

Electrostatic chuck design for high temperature RF applications

IBM

Apparatus for depositing material into high aspect ratio holes

Ceramic electrostatic wafer chuck

Plasma wafer processing tool having closed electron cyclotron resonance

Residue free vertical pattern transfer with top surface imaging resists

Scanned electron cyclotron resonance plasma source

Selective fluorocarbon-based RIE process utilizing a nitrogen additive

Reaction chamber interelectrode gap monitoring by capacitance measurement

Gettering of particles during plasma processing

Apparatus for gettering of particles during plasma processing

Method of reducing particulates in a plasma tool through steady state flows

Method and apparatus for reducing particulates in a plasma tool through steady state flows

DING PEIJUN

Self-ionized and inductively-coupled plasma for sputtering and resputtering

Self-ionized and inductively-coupled plasma for sputtering and resputtering

FORSTER JOHN C

Method for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning

GOPALRAJA PRABURAM

Self-ionized and capacitively-coupled plasma for sputtering and resputtering

NULMAN JAIM

Coils for generating a plasma and for sputtering

GUNG TZA-JING

Electromagnet array in a sputter reactor