Inventor

TSANG LEUNG

US2 patents

⚠️ This page may combine multiple inventors who share the name “TSANG LEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNIV WASHINGTON

1 patent

US7149666B2Dec 12, 2006

Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures

UNIV WASHINGTON46 citations87

UNIV CITY HONG KONG

1 patent

US7359929B2Apr 15, 2008

Fast solution of integral equations representing wave propagation

UNIV CITY HONG KONG7 citations71