Inventor
LIN GENG
US17 patents
⚠️ This page may combine multiple inventors who share the name “LIN GENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DELL PRODUCTS LP
10 patentsUS9009349B2Apr 14, 2015
System and method for dataplane extensibility in a flow-based switching device
DELL PRODUCTS LP18 citations90
US9258253B2Feb 9, 2016
System and method for flexible switching fabric
DELL PRODUCTS LP8 citations84
US9665521B2May 30, 2017
System and method for providing a processing node with input/output functionality by an I/O complex switch
DELL PRODUCTS LP4 citations83
US9122810B2Sep 1, 2015
System and method for providing input/output functionality to a processing node
DELL PRODUCTS LP9 citations83
US9191262B2Nov 17, 2015
Network communication protocol processing optimization system
DELL PRODUCTS LP5 citations69
US9442876B2Sep 13, 2016
System and method for providing network access for a processing node
DELL PRODUCTS LP2 citations62
US10102170B2Oct 16, 2018
System and method for providing input/output functionality by an I/O complex switch
DELL PRODUCTS LP0 citations51
US9875204B2Jan 23, 2018
System and method for providing a processing node with input/output functionality provided by an I/O complex switch
DELL PRODUCTS LP0 citations51
US9509597B2Nov 29, 2016
System and method for dataplane extensibility in a flow-based switching device
DELL PRODUCTS LP0 citations50
US9491265B2Nov 8, 2016
Network communication protocol processing optimization system
DELL PRODUCTS LP0 citations48
SIKA TECH AG
4 patentsUS10836881B2Nov 17, 2020
Pumpable and thermally expandable filler compositions
SIKA TECH AG2 citations68
US11192995B2Dec 7, 2021
Heat expandable foam for low temperature cure
SIKA TECH AG1 citations53
US11377532B2Jul 5, 2022
Approach to heat expandable materials
SIKA TECH AG0 citations46
US11781048B2Oct 10, 2023
One-component thermosetting epoxy adhesive with improved adhesion
SIKA TECH AG0 citations44