Inventor · disambiguated record
Keochang Lee
Also filed as: LEE KEOCHANG
4 granted patents·23 citations·filing 2013–2017
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0188US9859200B2Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2015·Granted Jan 2, 2018·8 cites·10 claims
- 0281US10418332B2Semiconductor device and method of forming partition fence and shielding layer around semiconductor componentsSTATS CHIPPAC PTE LTD·Filed 2017·Granted Sep 17, 2019·5 cites·22 claims
- 0378US9076802B1Dual-sided film-assist molding processKO WONJUN·Filed 2013·Granted Jul 7, 2015·6 cites·18 claims
- 0473US9184067B1Methods of mitigating defects for semiconductor packagesKIM KYUNGHWAN·Filed 2013·Granted Nov 10, 2015·4 cites·20 claims
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