Inventor
YEO YONG WOON
KR5 patents
Patents
5 patentsUS7170170B2Jan 30, 2007
Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
NEPES CO LTD15 citations78
US10804146B2Oct 13, 2020
Method for producing semiconductor package
NEPES CO LTD2 citations71
US11404347B2Aug 2, 2022
Semiconductor package
NEPES CO LTD0 citations50
US12198997B2Jan 14, 2025
Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients
NEPES CO LTD0 citations46
US11264330B2Mar 1, 2022
Chip package with connection portion that passes through an encapsulation portion
NEPES CO LTD0 citations45