Inventor
Huang pei-chang
TW16 patents
Patents
16 patentsUS12588135B2Mar 24, 2026
Method of manufacturing circuit board
UNIMICRON TECHNOLOGY CORP0 citations61
US11445596B2Sep 13, 2022
Circuit board having heat-dissipation block and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations61
US9159713B1Oct 13, 2015
Opto-electronic circuit board and method for assembling the same
UNIMICRON TECHNOLOGY CORP2 citations61
US11373927B2Jun 28, 2022
Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole
UNIMICRON TECHNOLOGY CORP0 citations51
US9739963B2Aug 22, 2017
Manufacturing method of optical component
UNIMICRON TECHNOLOGY CORP0 citations51
US9581774B2Feb 28, 2017
Optical-electro circuit board
UNIMICRON TECHNOLOGY CORP0 citations51
US9377596B2Jun 28, 2016
Optical-electro circuit board, optical component and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations51
US8979372B2Mar 17, 2015
Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
UNIMICRON TECHNOLOGY CORP0 citations51
US11997785B2May 28, 2024
Circuit board
UNIMICRON TECHNOLOGY CORP0 citations50
US10881006B2Dec 29, 2020
Package carrier and package structure
UNIMICRON TECHNOLOGY CORP0 citations49
US11641720B2May 2, 2023
Circuit board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations46
US10515870B1Dec 24, 2019
Package carrier having a mesh gas-permeable structure disposed in the through hole
UNIMICRON TECHNOLOGY CORP0 citations41
US9335470B2May 10, 2016
Opto-electronic circuit board and method for assembling the same
UNIMICRON TECHNOLOGY CORP0 citations40
US9288917B2Mar 15, 2016
Manufacturing method for multi-layer circuit board
UNIMICRON TECHNOLOGY CORP0 citations40
US9095083B2Jul 28, 2015
Manufacturing method for multi-layer circuit board
UNIMICRON TECHNOLOGY CORP0 citations40
US9198303B2Nov 24, 2015
Manufacturing method for multi-layer circuit board
UNIMICRON TECHNOLOGY CORP0 citations35