Inventor
TAKAMI MASATO
DE21 patents
⚠️ This page may combine multiple inventors who share the name “TAKAMI MASATO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BOSCH GMBH ROBERT
9 patentsUS11468687B2Oct 11, 2022
Training and operating a machine learning system
BOSCH GMBH ROBERT7 citations83
US11113561B2Sep 7, 2021
Method, artificial neural network, device, computer program and machine-readable memory medium for the semantic segmentation of image data
BOSCH GMBH ROBERT2 citations67
US11908142B2Feb 20, 2024
Method, artificial neural network, device, computer program, and machine-readable memory medium for the semantic segmentation of image data
BOSCH GMBH ROBERT0 citations56
US11100358B2Aug 24, 2021
Method, artificial neural network, device, computer program and machine-readable memory medium for the semantic segmentation of image data
BOSCH GMBH ROBERT0 citations55
US9846031B2Dec 19, 2017
Method and system for testing a vehicle underbody of a motor vehicle
BOSCH GMBH ROBERT0 citations52
US9580018B2Feb 28, 2017
Device and method for recording images of a vehicle underbody
BOSCH GMBH ROBERT1 citations51
US12190691B2Jan 7, 2025
Method for determining a noteworthy sub-sequence of a monitoring image sequence
BOSCH GMBH ROBERT0 citations49
US11875581B2Jan 16, 2024
Method for generating a monitoring image
BOSCH GMBH ROBERT0 citations47
US11610096B2Mar 21, 2023
Evaluation system for measured data from multiple domains
BOSCH GMBH ROBERT0 citations44
FUKUDA METAL FOIL AND POWDER C
5 patentsUS5234573AAug 10, 1993
Method of surface treatment of copper foil for printed circuit boards and copper foil for printed circuit boards
FUKUDA METAL FOIL AND POWDER C23 citations91
US5338619AAug 16, 1994
Copper foil for printed circuits and method of producing same
FUKUDA METAL FOIL AND POWDER C30 citations89
US5700362ADec 23, 1997
Method of treating copper foil for printed circuits
FUKUDA METAL FOIL AND POWDER C28 citations88
US5567534AOct 22, 1996
Foil for a printed circuit
FUKUDA METAL FOIL AND POWDER C30 citations88
US5304428AApr 19, 1994
Copper foil for printed circuit boards
FUKUDA METAL FOIL AND POWDER C8 citations72
FUKUDA METAL FOIL POWDER
4 patentsUS4619871AOct 28, 1986
Copper foil for printed circuit board
FUKUDA METAL FOIL POWDER30 citations92
US4981560AJan 1, 1991
Method of surface treatment of copper foil or a copper clad laminate for internal layer
FUKUDA METAL FOIL POWDER31 citations87
US7037597B2May 2, 2006
Copper foil for printed-wiring board
FUKUDA METAL FOIL POWDER6 citations73
US5356528AOct 18, 1994
Copper foil for printed circuits and method of producing same
FUKUDA METAL FOIL POWDER13 citations71