Inventor · disambiguated record

Mitsuzi Koyama

Also filed as: KOYAMA MITSUZI

2 granted patents·51 citations·filing 1991–1993

65Inventor score

Technology areasH10P

Files withMITSUBISHI MATERIALS CORP2

Top patents by PatentIndex Score

2 records

0167US5254205AWafer binding method and apparatusMITSUBISHI MATERIALS CORP·Filed 1991·Granted Oct 19, 1993·40 cites·6 claims
0240US5310441AWafer binding method and apparatusMITSUBISHI MATERIALS CORP·Filed 1993·Granted May 10, 1994·11 cites·8 claims

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