P

Inventor

LANZETTA ALPHONSO P

US25 patents
⚠️ This page may combine multiple inventors who share the name “LANZETTA ALPHONSO P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

21 patents
US5559670ASep 24, 1996

Convertible display computer

IBM109 citations98
US5581576ADec 3, 1996

Radio information broadcasting and receiving system

IBM70 citations96
US5433631AJul 18, 1995

Flex circuit card elastomeric cable connector assembly

IBM85 citations96
US5386344AJan 31, 1995

Flex circuit card elastomeric cable connector assembly

IBM51 citations96
US5268815ADec 7, 1993

High density, high performance memory circuit package

IBM74 citations93
US5583510ADec 10, 1996

Planar antenna in the ISM band with an omnidirectional pattern in the horizontal plane

IBM49 citations92
US5117275AMay 26, 1992

Electronic substrate multiple location conductor attachment technology

IBM28 citations92
US5052606AOct 1, 1991

Tape automated bonding feeder

IBM27 citations92
US7452212B2Nov 18, 2008

Metalized elastomeric electrical contacts

IBM16 citations91
US5546655AAug 20, 1996

Method of applying flex tape protective coating onto a flex product

IBM21 citations91
US7492821B2Feb 17, 2009

System and method for selective image capture, transmission and reconstruction

IBM25 citations89
US6276844B1Aug 21, 2001

Clustered, buffered simms and assemblies thereof

IBM53 citations87
US7613368B2Nov 3, 2009

Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types

IBM9 citations84
US5360946ANov 1, 1994

Flex tape protective coating

IBM13 citations81
US5421079AJun 6, 1995

High density, high performance memory circuit package

IBM14 citations74
US5233221AAug 3, 1993

Electronic substrate multiple location conductor attachment technology

IBM11 citations73
US5229328AJul 20, 1993

Method for bonding dielectric mounted conductors to semiconductor chip contact pads

IBM17 citations73
US5558523ASep 24, 1996

Pad on pad type contact interconnection technology for electronic apparatus

IBM6 citations63
US8054095B2Nov 8, 2011

Metalized elastomeric probe structure

IBM4 citations61
US7771208B2Aug 10, 2010

Metalized elastomeric electrical contacts

IBM5 citations61
US5322204AJun 21, 1994

Electronic substrate multiple location conductor attachment technology

IBM0 citations52

COTEUS PAUL W

2 patents

HOUGHAM GARETH GEOFFREY

1 patent

BERMAN STEVEN T

1 patent