Inventor
YU BING-SHUN
TW3 patents
Patents
3 patentsUS7564123B1Jul 21, 2009
Semiconductor package with fastened leads
POWERTECH TECHNOLOGY INC16 citations80
US7884472B2Feb 8, 2011
Semiconductor package having substrate ID code and its fabricating method
POWERTECH TECHNOLOGY INC13 citations79
US7549568B1Jun 23, 2009
Method of forming identification code for wire-bonding machines
POWERTECH TECHNOLOGY INC1 citations48