Inventor

LEE KEUN-HYUK

KR17 patents

⚠️ This page may combine multiple inventors who share the name “LEE KEUN-HYUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KEUN-HYUK

FAIRCHILD KR SEMICONDUCTOR LTD

Semiconductor power package module

Power module having stacked flip-chip and method of fabricating the power module

Power system module and method of fabricating the same

Three-dimensional power semiconductor module and method of manufacturing the same

Power module having stacked flip-chip and method for fabricating the power module

Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same

Semiconductor package having insulated metal substrate and method of fabricating the same

High power semiconductor package

Power module for low thermal resistance and method of fabricating the same

Power system module and method of fabricating the same

Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same

Semiconductor package having insulated metal substrate and method of fabricating the same

Power module for low thermal resistance and method of fabricating the same

High power semiconductor package and method of making the same

Leadless package

LEE KEUN-HYUK

Power device package and semiconductor package mold for fabricating the same

Semiconductor power module packages with simplified structure and methods of fabricating the same