Inventor
MASUDA NAOMI
JP20 patents
⚠️ This page may combine multiple inventors who share the name “MASUDA NAOMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SPANSION LLC
7 patentsUS7605457B2Oct 20, 2009
Semiconductor device and method of manufacturing the same
SPANSION LLC18 citations92
US8030179B2Oct 4, 2011
Semiconductor device and method of manufacturing the same
SPANSION LLC8 citations83
US7816788B2Oct 19, 2010
Structure, method and system for assessing bonding of electrodes in FCB packaging
SPANSION LLC3 citations63
US8796864B2Aug 5, 2014
Flip chip bonded semiconductor device with shelf
SPANSION LLC2 citations62
US8765529B2Jul 1, 2014
Semiconductor device and method for manufacturing the same
SPANSION LLC3 citations62
US7892892B2Feb 22, 2011
Semiconductor device and method for manufacturing thereof
SPANSION LLC1 citations52
US7846780B2Dec 7, 2010
Flip-chip package covered with tape
SPANSION LLC0 citations51
MASUDA NAOMI
5 patentsUS8598717B2Dec 3, 2013
Semiconductor device and method for manufacturing the same
MASUDA NAOMI32 citations91
US8637986B2Jan 28, 2014
Semiconductor device and method for manufacturing thereof
MASUDA NAOMI7 citations82
US8486756B2Jul 16, 2013
Flip chip bonded semiconductor device with shelf and method of manufacturing thereof
MASUDA NAOMI3 citations61
US9385014B2Jul 5, 2016
Flip-chip package covered with tape
MASUDA NAOMI0 citations51
US8446015B2May 21, 2013
Semiconductor device and method for manufacturing thereof
MASUDA NAOMI0 citations51