Inventor

HIGAKI KENJIRO

JP56 patents

⚠️ This page may combine multiple inventors who share the name “HIGAKI KENJIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIGAKI KENJIRO

SUMITOMO ELECTRIC INDUSTRIES

Wafer holder for semiconductor manufacturing apparatus, method of manufacturing wafer holder, and semiconductor manufacturing apparatus

Surface acoustic wave element

Aluminum nitride sintered body and manufacturing method thereof

Surface acoustic wave device

Diamond-ZnO surface acoustic wave device having relatively thinner ZnO piezoelectric layer

Diamond-LiTaO3 surface acoustic wave device

Surface acoustic wave device

Orientational material, orientational substrate and surface acoustic wave device

Method of manufacturing a surface acoustic wave element

Surface acoustic wave device and method of manufacturing the same

Superconducting thin film

Surface acoustic wave element and method of manufacturing the same

Microwave resonator having a ground conductor partially composed of oxide superconductor material

Light emitting element mounting member, and semiconductor device using the same

Submount and semiconductor device

Submount and semiconductor device

Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device

Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device

Microwave resonator of compound oxide superconductor material having a tuning element with a superconductive tip

Semiconductor device

Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same

Wafer holder for semiconductor manufacturing apparatus, and method of manufacturing the wafer holder

Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device

Surface acoustic wave device incorporating single crystal LiNbO3

Diamond-ZnO surface acoustic wave device

Surface acoustic wave device and diamond base material for the same

Substrate having a superconductor layer

Microwave component of compound oxide superconductor material having crystal orientation for reducing electromagnetic field penetration

Polycrystalline diamond substrate and process for producing the same

Microwave resonator of compound oxide superconductor material having a temperature adjustable heater

Superconducting thin film and wire on a smooth substrate

Process for preparing a thin film of bi-type oxide superconductor

Process and apparatus for preparing superconducting thin films

Superconducting thin film and wire and a process for producing the same

Semiconductor device

Semiconductor device

Surface acoustic wave device and diamond base material for the same

Diamond-Zn0 surface acoustic wave device

Superconducting microwave parts having a package, three substrates, and line and grounding conductors

Superconducting microwave parts having a package, two substrates, and line and grounding conductors

Process for preparing superconductor of compound oxide of Bi-Sr-Ca-Cu system

Process for producing a superconducting thin film at relatively low temperature

Process for depositing tl-containing superconducting thin films on (110) mgo substrates

Process for preparing a bismuth-type superconducting thin film

Superconducting thin film and a process for depositing the same

Superconducting thin film and a process for depositing the same

ALMT CORP

Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

NEC CORP

Surface acoustic wave device

SUMITOMO ELECTRONIC IND LTD

Diamond-ZnO surface acoustic wave device