Inventor
IKEMIZU MORIHIKO
JP11 patents
Patents
11 patentsUS6326243B1Dec 4, 2001
Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
TOSHIBA KK200 citations97
US5612259AMar 18, 1997
Method for manufacturing a semiconductor device wherein a semiconductor chip is mounted on a lead frame
TOSHIBA KK82 citations94
US5359222AOct 25, 1994
TCP type semiconductor device capable of preventing crosstalk
TOSHIBA KK49 citations94
US5892277AApr 6, 1999
Tab tape and semiconductor device using the tab tape
TOSHIBA KK62 citations92
US5753969AMay 19, 1998
Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
TOSHIBA KK25 citations91
US5659198AAug 19, 1997
TCP type semiconductor device capable of preventing crosstalk
TOSHIBA KK42 citations90
US6097085AAug 1, 2000
Electronic device and semiconductor package
TOSHIBA KK33 citations88
US5652184AJul 29, 1997
Method of manufacturing a thin semiconductor package having many pins and likely to dissipate heat
TOSHIBA KK5 citations73
US5442232AAug 15, 1995
Thin semiconductor package having many pins and likely to dissipate heat
TOSHIBA KK10 citations73
US6495922B2Dec 17, 2002
Semiconductor device with pointed bumps
TOSHIBA KK2 citations59
US10840166B2Nov 17, 2020
Semiconductor device
TOSHIBA KK0 citations36