Inventor
TEPMAN AVI
US88 patents
⚠️ This page may combine multiple inventors who share the name “TEPMAN AVI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
49 patentsUS6440261B1Aug 27, 2002
Dual buffer chamber cluster tool for semiconductor wafer processing
APPLIED MATERIALS INC482 citations99
US6350353B2Feb 26, 2002
Alternate steps of IMP and sputtering process to improve sidewall coverage
APPLIED MATERIALS INC175 citations99
US6129044AOct 10, 2000
Apparatus for substrate processing with improved throughput and yield
APPLIED MATERIALS INC578 citations99
US5846332ADec 8, 1998
Thermally floating pedestal collar in a chemical vapor deposition chamber
APPLIED MATERIALS INC863 citations99
US5730801AMar 24, 1998
Compartnetalized substrate processing chamber
APPLIED MATERIALS INC836 citations99
US5540821AJul 30, 1996
Method and apparatus for adjustment of spacing between wafer and PVD target during semiconductor processing
APPLIED MATERIALS INC365 citations99
US5447409ASep 5, 1995
Robot assembly
APPLIED MATERIALS INC144 citations99
US5186718AFeb 16, 1993
Staged-vacuum wafer processing system and method
APPLIED MATERIALS INC998 citations99
US6777352B2Aug 17, 2004
Variable flow deposition apparatus and method in semiconductor substrate processing
APPLIED MATERIALS INC119 citations98
US6258220B1Jul 10, 2001
Electro-chemical deposition system
APPLIED MATERIALS INC443 citations98
US6136163AOct 24, 2000
Apparatus for electro-chemical deposition with thermal anneal chamber
APPLIED MATERIALS INC569 citations98
US6045620AApr 4, 2000
Two-piece slit valve insert for vacuum processing system
APPLIED MATERIALS INC116 citations98
US5964947AOct 12, 1999
Removable pumping channel liners within a chemical vapor deposition chamber
APPLIED MATERIALS INC96 citations98
US5922133AJul 13, 1999
Multiple edge deposition exclusion rings
APPLIED MATERIALS INC95 citations98
US5885358AMar 23, 1999
Gas injection slit nozzle for a plasma process reactor
APPLIED MATERIALS INC203 citations98
US5879575AMar 9, 1999
Self-cleaning plasma processing reactor
APPLIED MATERIALS INC97 citations98
US5803977ASep 8, 1998
Apparatus for full wafer deposition
APPLIED MATERIALS INC137 citations98
US5746875AMay 5, 1998
Gas injection slit nozzle for a plasma process reactor
APPLIED MATERIALS INC169 citations98
US5320728AJun 14, 1994
Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
APPLIED MATERIALS INC148 citations98
US6866746B2Mar 15, 2005
Clamshell and small volume chamber with fixed substrate support
APPLIED MATERIALS INC130 citations97
US6603269B1Aug 5, 2003
Resonant chamber applicator for remote plasma source
APPLIED MATERIALS INC252 citations97
US6379466B1Apr 30, 2002
Temperature controlled gas distribution plate
APPLIED MATERIALS INC468 citations97
US5228501AJul 20, 1993
Physical vapor deposition clamping mechanism and heater/cooler
APPLIED MATERIALS INC357 citations97
US6641701B1Nov 4, 2003
Cooling system for magnetron sputtering apparatus
APPLIED MATERIALS INC52 citations96
US6368469B1Apr 9, 2002
Coils for generating a plasma and for sputtering
APPLIED MATERIALS INC48 citations96
US6298685B1Oct 9, 2001
Consecutive deposition system
APPLIED MATERIALS INC52 citations96
US6270859B2Aug 7, 2001
Plasma treatment of titanium nitride formed by chemical vapor deposition
APPLIED MATERIALS INC42 citations96
US6228235B1May 8, 2001
Magnetron for low pressure, full face erosion
APPLIED MATERIALS INC48 citations96
US6071055AJun 6, 2000
Front end vacuum processing environment
APPLIED MATERIALS INC61 citations96
US5883017AMar 16, 1999
Compartmentalized substrate processing chamber
APPLIED MATERIALS INC73 citations96
US5735339AApr 7, 1998
Semiconductor processing apparatus for promoting heat transfer between isolated volumes
APPLIED MATERIALS INC37 citations96
US5566744AOct 22, 1996
Apparatus and method to ensure heat transfer to and from an entire substrate during semiconductor processing
APPLIED MATERIALS INC49 citations96
US5223112AJun 29, 1993
Removable shutter apparatus for a semiconductor process chamber
APPLIED MATERIALS INC60 citations96
US6635157B2Oct 21, 2003
Electro-chemical deposition system
APPLIED MATERIALS INC43 citations95
US6071372AJun 6, 2000
RF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
APPLIED MATERIALS INC69 citations95
US5762748AJun 9, 1998
Lid and door for a vacuum chamber and pretreatment therefor
APPLIED MATERIALS INC56 citations95
US5589224ADec 31, 1996
Apparatus for full wafer deposition
APPLIED MATERIALS INC78 citations95
US5401319AMar 28, 1995
Lid and door for a vacuum chamber and pretreatment therefor
APPLIED MATERIALS INC69 citations95
US5171412ADec 15, 1992
Material deposition method for integrated circuit manufacturing
APPLIED MATERIALS INC138 citations95
US6935466B2Aug 30, 2005
Lift pin alignment and operation methods and apparatus
APPLIED MATERIALS INC59 citations94
US6296712B1Oct 2, 2001
Chemical vapor deposition hardware and process
APPLIED MATERIALS INC68 citations94
US5907220AMay 25, 1999
Magnetron for low pressure full face erosion
APPLIED MATERIALS INC60 citations94
US5226632AJul 13, 1993
Slit valve apparatus and method
APPLIED MATERIALS INC80 citations94
US6722834B1Apr 20, 2004
Robot blade with dual offset wafer supports
APPLIED MATERIALS INC48 citations93
US6430468B1Aug 6, 2002
Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber
APPLIED MATERIALS INC45 citations93
US6143086ANov 7, 2000
Apparatus for full wafer deposition
APPLIED MATERIALS INC30 citations93
US5951775ASep 14, 1999
Apparatus for full wafer deposition
APPLIED MATERIALS INC38 citations93
US5772858AJun 30, 1998
Method and apparatus for cleaning a target in a sputtering source
APPLIED MATERIALS INC53 citations93
US5527438AJun 18, 1996
Cylindrical sputtering shield
APPLIED MATERIALS INC37 citations93
(unassigned)
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