Inventor
JUNG YANG GYOO
KR9 patents
⚠️ This page may combine multiple inventors who share the name “JUNG YANG GYOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
4 patentsUS9916989B2Mar 13, 2018
System and method for laser assisted bonding of semiconductor die
AMKOR TECHNOLOGY INC11 citations90
US10304698B2May 28, 2019
System and method for laser assisted bonding of semiconductor die
AMKOR TECHNOLOGY INC7 citations82
US10763129B2Sep 1, 2020
System and method for laser assisted bonding of an electronic device
AMKOR TECHNOLOGY INC3 citations71
US9627348B2Apr 18, 2017
Laser assisted bonding for semiconductor die interconnections
AMKOR TECHNOLOGY INC1 citations50
SAMSUNG ELECTRONICS CO LTD
3 patentsUS11664331B2May 30, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US11217503B2Jan 4, 2022
Semiconductor package having logic semiconductor chip and memory packages on interposer
SAMSUNG ELECTRONICS CO LTD0 citations51
US11139253B2Oct 5, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50