Inventor
CHIU ANTHONY
US14 patents
⚠️ This page may combine multiple inventors who share the name “CHIU ANTHONY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
8 patentsUS9899292B2Feb 20, 2018
Top-side cooling of RF products in air cavity composite packages
QORVO US INC12 citations79
US10177064B2Jan 8, 2019
Air cavity package
QORVO US INC1 citations62
US11303009B2Apr 12, 2022
Packages for advanced antenna systems
QORVO US INC0 citations61
US12087656B2Sep 10, 2024
Package architecture utilizing wafer to wafer bonding
QORVO US INC0 citations60
US11637050B2Apr 25, 2023
Package architecture utilizing wafer to wafer bonding
QORVO US INC1 citations60
US11699629B2Jul 11, 2023
Integrated circuit die stacked with backer die including capacitors and thermal vias
QORVO US INC0 citations59
US12308326B2May 20, 2025
Electronic component with lid to manage radiation feedback
QORVO US INC0 citations54
US11948893B2Apr 2, 2024
Electronic component with lid to manage radiation feedback
QORVO US INC0 citations54
ST MICROELECTRONICS INC
4 patentsUS6011301AJan 4, 2000
Stress reduction for flip chip package
ST MICROELECTRONICS INC43 citations94
US6214643B1Apr 10, 2001
Stress reduction for flip chip package
ST MICROELECTRONICS INC39 citations91
US6372543B1Apr 16, 2002
Wrap-around interconnect for fine pitch ball grid array
ST MICROELECTRONICS INC10 citations72
US6121678ASep 19, 2000
Wrap-around interconnect for fine pitch ball grid array
ST MICROELECTRONICS INC15 citations72