Inventor · disambiguated record
Haitao Fu
Also filed as: FU HAITAO
5 granted patents·1 pending application·3 citations·filing 2008–2023
62Inventor score
Files withHUAWEI TECH CO LTD2CHENG FANXIONG1CHINA YANGTZE POWER CO LTD1SHANGHAI MEADVILLE SCIENCE & TECH CO LTD1TTM TECH NORTH AMERICA LLC1
Top patents by PatentIndex Score
6 records- 0160US12374973B2Repair device for burnout of stator iron core in giant hydraulic turbine generator, and repair method thereofCHINA YANGTZE POWER CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·5 claims
- 0252US12306244B2Test circuit in chip and circuit test methodHUAWEI TECH CO LTD·Filed 2023·Granted May 20, 2025·0 cites·18 claims
- 0351US12181519B2Chip test circuit and circuit test methodHUAWEI TECH CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0451US2025087500A1Method for preparing fcbga package substrateSHANGHAI MEADVILLE SCIENCE & TECH CO LTD·Filed 2022·Application pending·0 cites
- 0550US8277668B2Methods of preparing printed circuit boards and packaging substrates of integrated circuitCHENG FANXIONG·Filed 2008·Granted Oct 2, 2012·3 cites·9 claims
- 0642US11693181B2High-density optical waveguide structure and printed circuit board and preparation method thereofTTM TECH NORTH AMERICA LLC·Filed 2019·Granted Jul 4, 2023·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →