Inventor
CHENG CHIA-HAO
TW7 patents
Patents
7 patentsUS11011466B2May 18, 2021
Integrated circuit package with integrated voltage regulator
ADVANCED MICRO DEVICES INC4 citations71
US12183675B2Dec 31, 2024
Fan-out packages with warpage resistance
ADVANCED MICRO DEVICES INC0 citations61
US11742301B2Aug 29, 2023
Fan-out package with reinforcing rivets
ADVANCED MICRO DEVICES INC1 citations61
US11715691B2Aug 1, 2023
Integrated circuit package with integrated voltage regulator
ADVANCED MICRO DEVICES INC0 citations61
US11309222B2Apr 19, 2022
Semiconductor chip with solder cap probe test pads
ADVANCED MICRO DEVICES INC0 citations61
US12424560B2Sep 23, 2025
Semiconductor chip device
ADVANCED MICRO DEVICES INC0 citations50
US12394683B2Aug 19, 2025
Molded semiconductor chip package with stair-step molding layer
ADVANCED MICRO DEVICES INC0 citations50