Inventor
YANG YAU-CHING
TW4 patents
Patents
4 patentsUS12487185B2Dec 2, 2025
Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metrics
GLOBALWAFERS CO LTD0 citations51
US12482662B2Nov 25, 2025
Systems and methods for producing epitaxial wafers
GLOBALWAFERS CO LTD0 citations47
US12420376B2Sep 23, 2025
Polishing head assembly having recess and cap
GLOBALWAFERS CO LTD0 citations47
US12594644B2Apr 7, 2026
Polishing head assembly having recess and cap
GLOBALWAFERS CO LTD0 citations44