Inventor
TANDY PATRICK W
US42 patents
⚠️ This page may combine multiple inventors who share the name “TANDY PATRICK W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
37 patentsUS7107019B2Sep 12, 2006
Methods of operating microelectronic devices, and methods of providing microelectronic devices
MICRON TECHNOLOGY INC81 citations99
US6718163B2Apr 6, 2004
Methods of operating microelectronic devices, and methods of providing microelectronic devices
MICRON TECHNOLOGY INC116 citations99
US6542720B1Apr 1, 2003
Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices
MICRON TECHNOLOGY INC129 citations99
US6331453B1Dec 18, 2001
Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities
MICRON TECHNOLOGY INC154 citations99
US6265660B1Jul 24, 2001
Package stack via bottom leaded plastic (BLP) packaging
MICRON TECHNOLOGY INC106 citations99
US6212767B1Apr 10, 2001
Assembling a stacked die package
MICRON TECHNOLOGY INC271 citations99
US5986209ANov 16, 1999
Package stack via bottom leaded plastic (BLP) packaging
MICRON TECHNOLOGY INC399 citations99
US6210992B1Apr 3, 2001
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC172 citations98
US6577004B1Jun 10, 2003
Solder ball landpad design to improve laminate performance
MICRON TECHNOLOGY INC75 citations96
US6146919ANov 14, 2000
Package stack via bottom leaded plastic (BLP) packaging
MICRON TECHNOLOGY INC36 citations96
US6899534B2May 31, 2005
Mold assembly for a package stack via bottom-leaded plastic (blp) packaging
MICRON TECHNOLOGY INC14 citations93
US6660558B1Dec 9, 2003
Semiconductor package with molded flash
MICRON TECHNOLOGY INC39 citations93
US6403457B2Jun 11, 2002
Selectively coating bond pads
MICRON TECHNOLOGY INC23 citations93
US6392289B1May 21, 2002
Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same
MICRON TECHNOLOGY INC17 citations93
US6140695AOct 31, 2000
Compression layer on the leadframe to reduce stress defects
MICRON TECHNOLOGY INC29 citations93
US6521980B1Feb 18, 2003
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC25 citations92
US6429385B1Aug 6, 2002
Non-continuous conductive layer for laminated substrates
MICRON TECHNOLOGY INC13 citations82
US6213747B1Apr 10, 2001
Package stack via bottom leaded plastic (BLP) packaging
MICRON TECHNOLOGY INC10 citations82
US6188021B1Feb 13, 2001
Package stack via bottom leaded plastic (BLP) packaging
MICRON TECHNOLOGY INC13 citations82
US6166328ADec 26, 2000
Package stack via bottom leaded plastic (BLP) packaging
MICRON TECHNOLOGY INC14 citations82
US5923081AJul 13, 1999
Compression layer on the leadframe to reduce stress defects
MICRON TECHNOLOGY INC12 citations82
US7094046B2Aug 22, 2006
Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
MICRON TECHNOLOGY INC4 citations74
US6729024B2May 4, 2004
Method of forming a non-continuous conductive layer for laminated substrates
MICRON TECHNOLOGY INC6 citations74
US6553658B2Apr 29, 2003
Assembling a stacked die package
MICRON TECHNOLOGY INC6 citations74
US6537051B2Mar 25, 2003
Encapsulation mold with a castellated inner surface
MICRON TECHNOLOGY INC5 citations74
US6499213B2Dec 31, 2002
Assembling a stacked die package
MICRON TECHNOLOGY INC10 citations74
US6404216B1Jun 11, 2002
Test contact
MICRON TECHNOLOGY INC11 citations74
US6395579B2May 28, 2002
Controlling packaging encapsulant leakage
MICRON TECHNOLOGY INC10 citations73
US6914326B2Jul 5, 2005
Solder ball landpad design to improve laminate performance
MICRON TECHNOLOGY INC11 citations71
US6486539B1Nov 26, 2002
Compression layer on the leadframe to reduce stress defects
MICRON TECHNOLOGY INC3 citations63
US6221695B1Apr 24, 2001
Method for fabricating a compression layer on the dead frame to reduce stress defects
MICRON TECHNOLOGY INC1 citations63
US7216425B2May 15, 2007
Method of forming a non-continuous conductive layer for laminated substrates
MICRON TECHNOLOGY INC0 citations52
US6998714B2Feb 14, 2006
Selectively coating bond pads
MICRON TECHNOLOGY INC0 citations52
US6756606B2Jun 29, 2004
Apparatus and method for marking defective sections of laminate substrates
MICRON TECHNOLOGY INC0 citations52
US6727437B2Apr 27, 2004
Non-continuous conductive layer for laminated substrates
MICRON TECHNOLOGY INC0 citations52
US6658727B2Dec 9, 2003
Method for assembling die package
MICRON TECHNOLOGY INC0 citations52
US6657288B2Dec 2, 2003
Compression layer on the lead frame to reduce stress defects
MICRON TECHNOLOGY INC0 citations52
ROUND ROCK RES LLC
3 patentsUS7778621B2Aug 17, 2010
Methods of operating electronic devices, and methods of providing electronic devices
ROUND ROCK RES LLC75 citations99
US8036629B2Oct 11, 2011
Methods of operating electronic devices, and methods of providing electronic devices
ROUND ROCK RES LLC72 citations98
US7951646B2May 31, 2011
Solder ball landpad design to improve laminate performance
ROUND ROCK RES LLC0 citations50