Inventor
VOS DAVID L
US25 patents
⚠️ This page may combine multiple inventors who share the name “VOS DAVID L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LOCKHEED CORP
21 patentsUS7995344B2Aug 9, 2011
High performance large tolerance heat sink
LOCKHEED CORP63 citations93
US6002588ADec 14, 1999
Thermally conductive vibration isolators
LOCKHEED CORP70 citations93
US6330152B1Dec 11, 2001
Apparatus facilitating use of cots electronics in harsh environments
LOCKHEED CORP104 citations92
US7324336B2Jan 29, 2008
Flow through cooling assemblies for conduction-cooled circuit modules
LOCKHEED CORP42 citations90
US6151216ANov 21, 2000
Thermally conductive vibration isolators
LOCKHEED CORP27 citations89
US6064575AMay 16, 2000
Circuit module assembly
LOCKHEED CORP41 citations89
US9426931B2Aug 23, 2016
Fluid-flow-through cooling of circuit boards
LOCKHEED CORP16 citations88
US10371462B2Aug 6, 2019
Integrated multi-chamber heat exchanger
LOCKHEED CORP5 citations83
US7203574B2Apr 10, 2007
Self-sustaining environmental control unit
LOCKHEED CORP14 citations83
US10527362B2Jan 7, 2020
Integrated multi-chamber heat exchanger
LOCKHEED CORP7 citations80
US10914535B2Feb 9, 2021
Integrated multi-chamber heat exchanger
LOCKHEED CORP1 citations72
US10461018B2Oct 29, 2019
Integrated multi-chamber heat exchanger
LOCKHEED CORP3 citations72
US10923876B1Feb 16, 2021
Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof
LOCKHEED CORP2 citations70
US10816280B2Oct 27, 2020
Integrated multi-chamber heat exchanger
LOCKHEED CORP4 citations69
US10548243B2Jan 28, 2020
Process for installing an insert for fluid-flow-through cooling of circuit boards
LOCKHEED CORP2 citations68
US7272468B2Sep 18, 2007
Self-sustaining environmental control unit
LOCKHEED CORP2 citations62
US7719108B2May 18, 2010
Enhanced reliability semiconductor package
LOCKHEED CORP3 citations58
US7670877B2Mar 2, 2010
Reliability enhancement process
LOCKHEED CORP3 citations57
US10362713B2Jul 23, 2019
Process for making an apparatus with fluid-flow-through cooling of circuit boards
LOCKHEED CORP0 citations48
US9673514B2Jun 6, 2017
Dimensionally tolerant multiband conformal antenna arrays
LOCKHEED CORP0 citations45
US9389103B1Jul 12, 2016
Sensor array packaging solution
LOCKHEED CORP0 citations45
VOS DAVID L
3 patentsUS8730673B2May 20, 2014
Fluid-cooled module for integrated circuit devices
VOS DAVID L14 citations82
US8847823B2Sep 30, 2014
Dimensionally tolerant multiband conformal antenna arrays
VOS DAVID L5 citations76
US9851161B2Dec 26, 2017
Heat exchanger construction using low temperature sinter techniques
VOS DAVID L0 citations30