P

Inventor

VOS DAVID L

US25 patents
⚠️ This page may combine multiple inventors who share the name “VOS DAVID L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LOCKHEED CORP

21 patents
US7995344B2Aug 9, 2011

High performance large tolerance heat sink

LOCKHEED CORP63 citations93
US6002588ADec 14, 1999

Thermally conductive vibration isolators

LOCKHEED CORP70 citations93
US6330152B1Dec 11, 2001

Apparatus facilitating use of cots electronics in harsh environments

LOCKHEED CORP104 citations92
US7324336B2Jan 29, 2008

Flow through cooling assemblies for conduction-cooled circuit modules

LOCKHEED CORP42 citations90
US6151216ANov 21, 2000

Thermally conductive vibration isolators

LOCKHEED CORP27 citations89
US6064575AMay 16, 2000

Circuit module assembly

LOCKHEED CORP41 citations89
US9426931B2Aug 23, 2016

Fluid-flow-through cooling of circuit boards

LOCKHEED CORP16 citations88
US10371462B2Aug 6, 2019

Integrated multi-chamber heat exchanger

LOCKHEED CORP5 citations83
US7203574B2Apr 10, 2007

Self-sustaining environmental control unit

LOCKHEED CORP14 citations83
US10527362B2Jan 7, 2020

Integrated multi-chamber heat exchanger

LOCKHEED CORP7 citations80
US10914535B2Feb 9, 2021

Integrated multi-chamber heat exchanger

LOCKHEED CORP1 citations72
US10461018B2Oct 29, 2019

Integrated multi-chamber heat exchanger

LOCKHEED CORP3 citations72
US10923876B1Feb 16, 2021

Phase-change material (PCM) embedded heat exchanger assembly for laser diode cooling and systems and methods thereof

LOCKHEED CORP2 citations70
US10816280B2Oct 27, 2020

Integrated multi-chamber heat exchanger

LOCKHEED CORP4 citations69
US10548243B2Jan 28, 2020

Process for installing an insert for fluid-flow-through cooling of circuit boards

LOCKHEED CORP2 citations68
US7272468B2Sep 18, 2007

Self-sustaining environmental control unit

LOCKHEED CORP2 citations62
US7719108B2May 18, 2010

Enhanced reliability semiconductor package

LOCKHEED CORP3 citations58
US7670877B2Mar 2, 2010

Reliability enhancement process

LOCKHEED CORP3 citations57
US10362713B2Jul 23, 2019

Process for making an apparatus with fluid-flow-through cooling of circuit boards

LOCKHEED CORP0 citations48
US9673514B2Jun 6, 2017

Dimensionally tolerant multiband conformal antenna arrays

LOCKHEED CORP0 citations45
US9389103B1Jul 12, 2016

Sensor array packaging solution

LOCKHEED CORP0 citations45

VOS DAVID L

3 patents

Lockheed Martin Corporpation

1 patent