Inventor

UESATO WARREN M

US2 patents

Patents

2 patents

US5164331ANov 17, 1992

Method of forming and etching titanium-tungsten interconnects

HEWLETT PACKARD CO48 citations87

US5223084AJun 29, 1993

Simultaneous dielectric planarization and contact hole etching

HEWLETT PACKARD CO11 citations66