Inventor
KRISHNARAJ PADMANABHAN
US26 patents
Patents
26 patentsUS7399388B2Jul 15, 2008
Sequential gas flow oxide deposition technique
APPLIED MATERIALS INC622 citations99
US7081414B2Jul 25, 2006
Deposition-selective etch-deposition process for dielectric film gapfill
APPLIED MATERIALS INC98 citations98
US6869880B2Mar 22, 2005
In situ application of etch back for improved deposition into high-aspect-ratio features
APPLIED MATERIALS INC241 citations98
US6863019B2Mar 8, 2005
Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas
APPLIED MATERIALS INC608 citations98
US6189483B1Feb 20, 2001
Process kit
APPLIED MATERIALS INC341 citations98
US6143078ANov 7, 2000
Gas distribution system for a CVD processing chamber
APPLIED MATERIALS INC147 citations98
US6486081B1Nov 26, 2002
Gas distribution system for a CVD processing chamber
APPLIED MATERIALS INC124 citations97
US7097886B2Aug 29, 2006
Deposition process for high aspect ratio trenches
APPLIED MATERIALS INC56 citations96
US6274058B1Aug 14, 2001
Remote plasma cleaning method for processing chambers
APPLIED MATERIALS INC106 citations94
US6175485B1Jan 16, 2001
Electrostatic chuck and method for fabricating the same
APPLIED MATERIALS INC18 citations92
US7722737B2May 25, 2010
Gas distribution system for improved transient phase deposition
APPLIED MATERIALS INC23 citations90
US6633076B2Oct 14, 2003
Methods and apparatus for producing stable low k FSG film for HDP-CVD
APPLIED MATERIALS INC24 citations90
US6511922B2Jan 28, 2003
Methods and apparatus for producing stable low k FSG film for HDP-CVD
APPLIED MATERIALS INC22 citations90
US7141138B2Nov 28, 2006
Gas delivery system for semiconductor processing
APPLIED MATERIALS INC13 citations83
US6812153B2Nov 2, 2004
Method for high aspect ratio HDP CVD gapfill
APPLIED MATERIALS INC13 citations83
US6596123B1Jul 22, 2003
Method and apparatus for cleaning a semiconductor wafer processing system
APPLIED MATERIALS INC15 citations82
US7431772B2Oct 7, 2008
Gas distributor having directed gas flow and cleaning method
APPLIED MATERIALS INC11 citations79
US6635144B2Oct 21, 2003
Apparatus and method for detecting an end point of chamber cleaning in semiconductor equipment
APPLIED MATERIALS INC11 citations74
US6715496B2Apr 6, 2004
Method and apparatus for cleaning a semiconductor wafer processing system
APPLIED MATERIALS INC10 citations71
US7799698B2Sep 21, 2010
Deposition-selective etch-deposition process for dielectric film gapfill
APPLIED MATERIALS INC4 citations63
US7691753B2Apr 6, 2010
Deposition-selective etch-deposition process for dielectric film gapfill
APPLIED MATERIALS INC3 citations63
US7189639B2Mar 13, 2007
Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide for semiconductor dielectric applications
APPLIED MATERIALS INC3 citations63
US6890597B2May 10, 2005
HDP-CVD uniformity control
APPLIED MATERIALS INC6 citations63
US7399707B2Jul 15, 2008
In situ application of etch back for improved deposition into high-aspect-ratio features
APPLIED MATERIALS INC3 citations62
US7064077B2Jun 20, 2006
Method for high aspect ratio HDP CVD gapfill
APPLIED MATERIALS INC2 citations61
US7498268B2Mar 3, 2009
Gas delivery system for semiconductor processing
APPLIED MATERIALS INC1 citations51