Inventor
JANG RUEI-HUNG
TW20 patents
⚠️ This page may combine multiple inventors who share the name “JANG RUEI-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
9 patentsUS7450296B2Nov 11, 2008
Method and system for patterning alignment marks on a transparent substrate
TAIWAN SEMICONDUCTOR MFG13 citations83
US7204751B2Apr 17, 2007
Method and apparatus for filtering contaminants
TAIWAN SEMICONDUCTOR MFG11 citations81
US6752897B2Jun 22, 2004
Wet etch system with overflow particle removing feature
TAIWAN SEMICONDUCTOR MFG7 citations71
US6601986B2Aug 5, 2003
Fluid mixing apparatus
TAIWAN SEMICONDUCTOR MFG9 citations70
US6687456B1Feb 3, 2004
In-line fluid heater
TAIWAN SEMICONDUCTOR MFG5 citations60
US6571607B2Jun 3, 2003
Fluid leak detection via thermal sensing
TAIWAN SEMICONDUCTOR MFG3 citations59
US7838386B2Nov 23, 2010
Method and system for patterning alignment marks on a transparent substrate
TAIWAN SEMICONDUCTOR MFG0 citations51
US6685842B2Feb 3, 2004
Thermophoretic particle removing system
TAIWAN SEMICONDUCTOR MFG0 citations48
US6971270B2Dec 6, 2005
Method and apparatus for measuring gripping strength of a vacuum wand
TAIWAN SEMICONDUCTOR MFG0 citations47
IND TECH RES INST
7 patentsUS6032689AMar 7, 2000
Integrated flow controller module
IND TECH RES INST101 citations95
US6206022B1Mar 27, 2001
Integrated flow controller module
IND TECH RES INST61 citations93
US6272866B1Aug 14, 2001
Micro cooling engine array system
IND TECH RES INST32 citations92
US6124632ASep 26, 2000
Monolithic silicon mass flow control structure
IND TECH RES INST40 citations91
US6229121B1May 8, 2001
Integrated thermal buckling micro switch with electric heater and sensor
IND TECH RES INST16 citations82
US6284195B1Sep 4, 2001
Disposable reaction module
IND TECH RES INST19 citations81
US6463649B1Oct 15, 2002
Method of manufacturing disposable reaction module
IND TECH RES INST2 citations60
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS10692966B2Jun 23, 2020
Deep trench capacitor with scallop profile
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations66
US11011462B2May 18, 2021
Method for forming fuse pad and bond pad of integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9391113B2Jul 12, 2016
Image-sensor device structure and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations46