Inventor
FRIESE GERALD
DE6 patents
Patents
6 patentsUS6730982B2May 4, 2004
FBEOL process for Cu metallizations free from Al-wirebond pads
INFINEON TECHNOLOGIES AG74 citations97
US6720212B2Apr 13, 2004
Method of eliminating back-end rerouting in ball grid array packaging
INFINEON TECHNOLOGIES AG96 citations96
US6451664B1Sep 17, 2002
Method of making a MIM capacitor with self-passivating plates
INFINEON TECHNOLOGIES AG51 citations94
US6866943B2Mar 15, 2005
Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level
INFINEON TECHNOLOGIES AG10 citations69
US7368804B2May 6, 2008
Method and apparatus of stress relief in semiconductor structures
INFINEON TECHNOLOGIES AG2 citations60
US7786007B2Aug 31, 2010
Method and apparatus of stress relief in semiconductor structures
INFINEON TECHNOLOGIES AG0 citations50