Inventor

LEUNG CHI KUEN VINCENT

HK4 patents

⚠️ This page may combine multiple inventors who share the name “LEUNG CHI KUEN VINCENT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEUNG CHI KUEN VINCENT

2 patents

US8194411B2Jun 5, 2012

Electronic package with stacked modules with channels passing through metal layers of the modules

LEUNG CHI KUEN VINCENT43 citations88

US8544165B2Oct 1, 2013

Apparatus for aligning electronic components

LEUNG CHI KUEN VINCENT0 citations48

HK APPLIED SCIENCE & TECH RES

2 patents

US8030208B2Oct 4, 2011

Bonding method for through-silicon-via based 3D wafer stacking

HK APPLIED SCIENCE & TECH RES16 citations82

US7832278B2Nov 16, 2010

Multi-chip package

HK APPLIED SCIENCE & TECH RES4 citations56