P

Inventor

SHI XUNQING

HK13 patents
⚠️ This page may combine multiple inventors who share the name “SHI XUNQING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HK APPLIED SCIENCE & TECH RES

4 patents
US8030208B2Oct 4, 2011

Bonding method for through-silicon-via based 3D wafer stacking

HK APPLIED SCIENCE & TECH RES16 citations82
US9066424B2Jun 23, 2015

Partitioned hybrid substrate for radio frequency applications

HK APPLIED SCIENCE & TECH RES5 citations71
US7879438B2Feb 1, 2011

Substrate warpage-reducing structure

HK APPLIED SCIENCE & TECH RES5 citations59
US9075941B2Jul 7, 2015

Method for optimizing electrodeposition process of a plurality of vias in wafer

HK APPLIED SCIENCE & TECH RES1 citations50

SHI XUNQING

2 patents
US8674482B2Mar 18, 2014

Semiconductor chip with through-silicon-via and sidewall pad

SHI XUNQING22 citations90
US8138577B2Mar 20, 2012

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

SHI XUNQING7 citations82

LEUNG CHI KUEN VINCENT

2 patents
US8194411B2Jun 5, 2012

Electronic package with stacked modules with channels passing through metal layers of the modules

LEUNG CHI KUEN VINCENT43 citations88
US8544165B2Oct 1, 2013

Apparatus for aligning electronic components

LEUNG CHI KUEN VINCENT0 citations48

LAW PUI CHUNG SIMON

2 patents
US8212297B1Jul 3, 2012

High optical efficiency CMOS image sensor

LAW PUI CHUNG SIMON18 citations79
US8772930B2Jul 8, 2014

Increased surface area electrical contacts for microelectronic packages

LAW PUI CHUNG SIMON0 citations37

HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD

2 patents
US10014280B2Jul 3, 2018

Three dimensional fully molded power electronics module having a plurality of spacers for high power applications

HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD1 citations48
US12529159B2Jan 20, 2026

Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding

HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD0 citations44

TSUI YAT KIT

1 patent
US8232626B2Jul 31, 2012

Via and method of via forming and method of via filling

TSUI YAT KIT7 citations79