Inventor
MAHAJAN RAVI
US13 patents
⚠️ This page may combine multiple inventors who share the name “MAHAJAN RAVI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS6934154B2Aug 23, 2005
Micro-channel heat exchangers and spreaders
INTEL CORP91 citations97
US6903929B2Jun 7, 2005
Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
INTEL CORP111 citations97
US5804771ASep 8, 1998
Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces
INTEL CORP111 citations97
US7539016B2May 26, 2009
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls
INTEL CORP17 citations92
US6992381B2Jan 31, 2006
Using external radiators with electroosmotic pumps for cooling integrated circuits
INTEL CORP16 citations92
US6700209B1Mar 2, 2004
Partial underfill for flip-chip electronic packages
INTEL CORP33 citations89
US6365441B1Apr 2, 2002
Partial underfill for flip-chip electronic packages
INTEL CORP30 citations89
US7764499B2Jul 27, 2010
Electromagnetically-actuated micropump for liquid metal alloy
INTEL CORP6 citations74
US6173489B1Jan 16, 2001
Organic substrate (PCB) slip plane “stress deflector” for flip chip devices
INTEL CORP5 citations73
US7576432B2Aug 18, 2009
Using external radiators with electroosmotic pumps for cooling integrated circuits
INTEL CORP1 citations52
MAHAJAN RAVI
2 patentsUS8064224B2Nov 22, 2011
Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
MAHAJAN RAVI155 citations95
US8441809B2May 14, 2013
Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same
MAHAJAN RAVI14 citations81