P

Inventor

PETERSON ERIC C

US139 patents
⚠️ This page may combine multiple inventors who share the name “PETERSON ERIC C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD DEVELOPMENT CO

23 patents
US7791889B2Sep 7, 2010

Redundant power beneath circuit board

HEWLETT PACKARD DEVELOPMENT CO118 citations98
US6634890B2Oct 21, 2003

Spring-loaded heat sink assembly for a circuit assembly

HEWLETT PACKARD DEVELOPMENT CO40 citations96
US6540531B2Apr 1, 2003

Clamp system for high speed cable termination

HEWLETT PACKARD DEVELOPMENT CO159 citations96
US7855888B2Dec 21, 2010

Cooling manifold assembly

HEWLETT PACKARD DEVELOPMENT CO38 citations93
US7647787B2Jan 19, 2010

Upgradeable, modular data center cooling apparatus

HEWLETT PACKARD DEVELOPMENT CO41 citations93
US7403396B2Jul 22, 2008

Communicating with an electronic module that is slidably mounted in a system

HEWLETT PACKARD DEVELOPMENT CO17 citations93
US7379297B2May 27, 2008

Air flow regulation devices

HEWLETT PACKARD DEVELOPMENT CO19 citations93
US6867976B2Mar 15, 2005

Pin retention for thermal transfer interfaces, and associated methods

HEWLETT PACKARD DEVELOPMENT CO21 citations93
US7499281B2Mar 3, 2009

Multi-chip module with power system

HEWLETT PACKARD DEVELOPMENT CO35 citations92
US7345885B2Mar 18, 2008

Heat spreader with multiple stacked printed circuit boards

HEWLETT PACKARD DEVELOPMENT CO38 citations92
US7336490B2Feb 26, 2008

Multi-chip module with power system

HEWLETT PACKARD DEVELOPMENT CO38 citations92
US7096926B2Aug 29, 2006

Thermal pouch interface

HEWLETT PACKARD DEVELOPMENT CO21 citations92
US7072185B1Jul 4, 2006

Electronic module for system board with pass-thru holes

HEWLETT PACKARD DEVELOPMENT CO27 citations92
US7068515B2Jun 27, 2006

Multi-chip module with stacked redundant power

HEWLETT PACKARD DEVELOPMENT CO46 citations92
US6746270B2Jun 8, 2004

Spring-loaded heat sink assembly for a circuit assembly

HEWLETT PACKARD DEVELOPMENT CO23 citations92
US7382613B2Jun 3, 2008

Computer system with external air mover

HEWLETT PACKARD DEVELOPMENT CO46 citations91
US7360104B2Apr 15, 2008

Redundant voltage distribution system and method for a memory module having multiple external voltages

HEWLETT PACKARD DEVELOPMENT CO29 citations91
US6748458B2Jun 8, 2004

Modular input/output expansion system for an external computer

HEWLETT PACKARD DEVELOPMENT CO22 citations90
US8038451B2Oct 18, 2011

Multi-board printed circuit assembly having aligned connectors

HEWLETT PACKARD DEVELOPMENT CO7 citations84
US7578733B2Aug 25, 2009

Enclosures with redundant fans in doors with interlocks

HEWLETT PACKARD DEVELOPMENT CO9 citations84
US7327569B2Feb 5, 2008

Processor module with thermal dissipation device

HEWLETT PACKARD DEVELOPMENT CO12 citations84
US7289328B2Oct 30, 2007

Multi-chip module with power system and pass-thru holes

HEWLETT PACKARD DEVELOPMENT CO16 citations84
US7254027B2Aug 7, 2007

Processor module for system board

HEWLETT PACKARD DEVELOPMENT CO10 citations84

HEWLETT PACKARD CO

7 patents

OTIS ELEVATOR CO

5 patents

PETERSON ERIC C

4 patents

MICROSOFT CORP

3 patents

MICROSOFT TECHNOLOGY LICENSING LLC

3 patents

UNIV NORTHERN IOWA RES FOUNDAT

2 patents

ALCOA FUJIKURA LIMITED

2 patents

ACCENTURE GLOBAL SERVICES LTD

1 patent

Showing the top 50 of 139 patents by PatentIndex Score.