Inventor
ASAI MOTOO
JP115 patents
⚠️ This page may combine multiple inventors who share the name “ASAI MOTOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
46 patentsUS7342803B2Mar 11, 2008
Printed circuit board and method of manufacturing printed circuit board
IBIDEN CO LTD92 citations99
US7307852B2Dec 11, 2007
Printed circuit board and method for manufacturing printed circuit board
IBIDEN CO LTD82 citations99
US6876554B1Apr 5, 2005
Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board
IBIDEN CO LTD160 citations99
US6828510B1Dec 7, 2004
Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
IBIDEN CO LTD176 citations99
US6724638B1Apr 20, 2004
Printed wiring board and method of producing the same
IBIDEN CO LTD249 citations99
US6534723B1Mar 18, 2003
Multilayer printed-circuit board and semiconductor device
IBIDEN CO LTD316 citations99
US6392898B1May 21, 2002
Package substrate
IBIDEN CO LTD82 citations99
US5175060ADec 29, 1992
Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same
IBIDEN CO LTD231 citations99
US5055321AOct 8, 1991
Adhesive for electroless plating, printed circuit boards and method of producing the same
IBIDEN CO LTD152 citations99
US7978478B2Jul 12, 2011
Printed circuit board
IBIDEN CO LTD46 citations98
US7622183B2Nov 24, 2009
Multilayer printed wiring board with filled viahole structure
IBIDEN CO LTD52 citations98
US7070207B2Jul 4, 2006
Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
IBIDEN CO LTD80 citations98
US6376052B1Apr 23, 2002
Multilayer printed wiring board and its production process, resin composition for filling through-hole
IBIDEN CO LTD117 citations98
US6376049B1Apr 23, 2002
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
IBIDEN CO LTD82 citations98
US6365843B1Apr 2, 2002
Multilayer printed wiring board
IBIDEN CO LTD85 citations98
US6217987B1Apr 17, 2001
Solder resist composition and printed circuit boards
IBIDEN CO LTD160 citations98
US7535095B1May 19, 2009
Printed wiring board and method for producing the same
IBIDEN CO LTD59 citations97
US7985930B2Jul 26, 2011
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
IBIDEN CO LTD30 citations96
US7855894B2Dec 21, 2010
Printed circuit board
IBIDEN CO LTD26 citations96
US7504719B2Mar 17, 2009
Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
IBIDEN CO LTD33 citations96
US7071424B1Jul 4, 2006
Multilayer printed wiring board having filled-via structure
IBIDEN CO LTD53 citations96
US6835895B1Dec 28, 2004
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD48 citations96
US6609297B1Aug 26, 2003
Method of manufacturing multilayer printed wiring board
IBIDEN CO LTD59 citations96
US6490170B2Dec 3, 2002
Package substrate
IBIDEN CO LTD41 citations96
US6487088B2Nov 26, 2002
Package substrate
IBIDEN CO LTD33 citations96
US6411519B2Jun 25, 2002
Package substrate
IBIDEN CO LTD56 citations96
US5741575AApr 21, 1998
Adhesive for printed circuit board
IBIDEN CO LTD34 citations95
US5344893ASep 6, 1994
Epoxy/amino powder resin adhesive for printed circuit board
IBIDEN CO LTD31 citations95
US6261671B1Jul 17, 2001
Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
IBIDEN CO LTD52 citations94
US6251502B1Jun 26, 2001
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD58 citations94
US6248428B1Jun 19, 2001
Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
IBIDEN CO LTD74 citations94
US6217988B1Apr 17, 2001
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD38 citations94
US6174353B1Jan 16, 2001
Pretreating solution for electroless plating, electroless plating bath and electroless plating process
IBIDEN CO LTD50 citations94
US6010768AJan 4, 2000
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
IBIDEN CO LTD74 citations94
US7737366B2Jun 15, 2010
Multilayer printed wiring board with filled viahole structure
IBIDEN CO LTD11 citations93
USRE41242EApr 20, 2010
Package substrate
IBIDEN CO LTD12 citations93
USRE40947EOct 27, 2009
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
IBIDEN CO LTD20 citations93
US7437030B2Oct 14, 2008
Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard
IBIDEN CO LTD25 citations93
US7390974B2Jun 24, 2008
Multilayer printed wiring board with filled viahole structure
IBIDEN CO LTD26 citations93
US7361849B2Apr 22, 2008
Printed wiring board and method for manufacturing the same
IBIDEN CO LTD16 citations93
US7127812B2Oct 31, 2006
Process for producing a multi-layer printed wiring board
IBIDEN CO LTD15 citations93
US6525275B1Feb 25, 2003
Multilayer printed circuit boards
IBIDEN CO LTD24 citations93
US5589255ADec 31, 1996
Adhesive for electroless plating, printed circuit boards and method of producing the same
IBIDEN CO LTD20 citations93
US8030577B2Oct 4, 2011
Printed wiring board and method for producing the same
IBIDEN CO LTD9 citations92
US8020291B2Sep 20, 2011
Method of manufacturing a printed wiring board
IBIDEN CO LTD13 citations92
US8018045B2Sep 13, 2011
Printed circuit board
IBIDEN CO LTD18 citations92
INAGAKI YASUSHI
3 patentsASAI MOTOO
1 patentShowing the top 50 of 115 patents by PatentIndex Score.