Inventor
NODA KOUTA
JP17 patents
⚠️ This page may combine multiple inventors who share the name “NODA KOUTA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
15 patentsUS6591495B2Jul 15, 2003
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
IBIDEN CO LTD102 citations98
US6376052B1Apr 23, 2002
Multilayer printed wiring board and its production process, resin composition for filling through-hole
IBIDEN CO LTD117 citations98
US6376049B1Apr 23, 2002
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
IBIDEN CO LTD82 citations98
US7691189B2Apr 6, 2010
Printed wiring board and its manufacturing method
IBIDEN CO LTD57 citations97
US7230188B1Jun 12, 2007
Printed wiring board and its manufacturing method
IBIDEN CO LTD55 citations96
US7415761B2Aug 26, 2008
Method of manufacturing multilayered circuit board
IBIDEN CO LTD35 citations95
US6261671B1Jul 17, 2001
Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
IBIDEN CO LTD52 citations94
US6248428B1Jun 19, 2001
Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
IBIDEN CO LTD74 citations94
US5841190ANov 24, 1998
High density multi-layered printed wiring board, multi-chip carrier and semiconductor package
IBIDEN CO LTD75 citations94
USRE40947EOct 27, 2009
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
IBIDEN CO LTD20 citations93
US6762921B1Jul 13, 2004
Multilayer printed-circuit board and method of manufacture
IBIDEN CO LTD52 citations92
US6512186B1Jan 28, 2003
Multilayer printed wiring board having a roughened inner conductor layer and production method thereof
IBIDEN CO LTD45 citations87
US8021748B2Sep 20, 2011
Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same
IBIDEN CO LTD17 citations84
US7827680B2Nov 9, 2010
Electroplating process of electroplating an elecrically conductive sustrate
IBIDEN CO LTD11 citations84
US7832098B2Nov 16, 2010
Method of manufacturing a multilayered printed circuit board
IBIDEN CO LTD10 citations83