Inventor
SEGAWA HIROSHI
JP51 patents
⚠️ This page may combine multiple inventors who share the name “SEGAWA HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
18 patentsUS5379257AJan 3, 1995
Semiconductor integrated circuit device having a memory and an operational unit integrated therein
MITSUBISHI ELECTRIC CORP429 citations99
US5394355AFeb 28, 1995
Read only memory for storing multi-data
MITSUBISHI ELECTRIC CORP111 citations98
US6125432ASep 26, 2000
Image process apparatus having a storage device with a plurality of banks storing pixel data, and capable of precharging one bank while writing to another bank
MITSUBISHI ELECTRIC CORP56 citations96
US6011589AJan 4, 2000
Picture coding device where the quantization step is adjusted in response to a motion vector
MITSUBISHI ELECTRIC CORP68 citations96
US4797585AJan 10, 1989
Pulse generating circuit in a semiconductor integrated circuit and a delay circuit therefor
MITSUBISHI ELECTRIC CORP55 citations96
US5457698AOct 10, 1995
Test circuit having a plurality of scan latch circuits
MITSUBISHI ELECTRIC CORP22 citations93
US5289406AFeb 22, 1994
Read only memory for storing multi-data
MITSUBISHI ELECTRIC CORP23 citations93
US6516031B1Feb 4, 2003
Motion vector detecting device
MITSUBISHI ELECTRIC CORP31 citations92
US6122317ASep 19, 2000
Motion vector detector
MITSUBISHI ELECTRIC CORP46 citations92
US5651123AJul 22, 1997
Program execution control device having addressability in accordance with M series pseudo-random number sequence
MITSUBISHI ELECTRIC CORP36 citations92
US5761134AJun 2, 1998
Data reading circuit
MITSUBISHI ELECTRIC CORP8 citations74
US4913557AApr 3, 1990
Intergrated logic circuit having testing function circuit formed integrally therewith
MITSUBISHI ELECTRIC CORP14 citations74
US4910734AMar 20, 1990
Intergrated circuit having testing function circuit and control circuit therefor
MITSUBISHI ELECTRIC CORP8 citations74
US4829237AMay 9, 1989
Circuit device having a self-testing function and a testing method thereof
MITSUBISHI ELECTRIC CORP15 citations74
US6141451AOct 31, 2000
Image coding method and apparatus
MITSUBISHI ELECTRIC CORP4 citations63
US5053642AOct 1, 1991
Bus circuit and operating method thereof
MITSUBISHI ELECTRIC CORP3 citations62
US5093724AMar 3, 1992
Semiconductor device containing video signal processing circuit
MITSUBISHI ELECTRIC CORP0 citations52
US4924314AMay 8, 1990
Semiconductor device containing video signal processing circuit
MITSUBISHI ELECTRIC CORP1 citations52
RENESAS TECH CORP
7 patentsUS7023926B2Apr 4, 2006
Stream converting apparatus that converts data stream of first format possibly containing error into correct data stream of second format
RENESAS TECH CORP17 citations84
US6792006B1Sep 14, 2004
Data multiplexing device multiplexing transport stream generated from encoded data
RENESAS TECH CORP15 citations84
US6708246B1Mar 16, 2004
Signal processing device with bus ownership control function
RENESAS TECH CORP14 citations84
US6765961B2Jul 20, 2004
Encoding device mounted on one chip for multiplexing video signal and audio signal
RENESAS TECH CORP7 citations74
US6918002B2Jul 12, 2005
Data processor and data processing method reduced in power consumption during memory access
RENESAS TECH CORP8 citations71
US7457525B2Nov 25, 2008
System multiplexing apparatus preventing overflow of audio decoder buffer
RENESAS TECH CORP4 citations63
US6907068B2Jun 14, 2005
Image compressing coding apparatus and method for detecting a top position of an image in a buffer overflow
RENESAS TECH CORP5 citations63
IBIDEN CO LTD
6 patentsUS6591495B2Jul 15, 2003
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
IBIDEN CO LTD102 citations98
US6376052B1Apr 23, 2002
Multilayer printed wiring board and its production process, resin composition for filling through-hole
IBIDEN CO LTD117 citations98
US6376049B1Apr 23, 2002
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
IBIDEN CO LTD82 citations98
US7415761B2Aug 26, 2008
Method of manufacturing multilayered circuit board
IBIDEN CO LTD35 citations95
USRE40947EOct 27, 2009
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
IBIDEN CO LTD20 citations93
US7832098B2Nov 16, 2010
Method of manufacturing a multilayered printed circuit board
IBIDEN CO LTD10 citations83
SAKAMOTO HAJIME
4 patentsUS8058563B2Nov 15, 2011
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME4 citations63
US8188378B2May 29, 2012
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME4 citations62
US8997344B2Apr 7, 2015
Method for manufacturing interposer
SAKAMOTO HAJIME0 citations52
US8173907B2May 8, 2012
Interposer and method for manufacturing interposer
SAKAMOTO HAJIME0 citations52
SEGAWA HIROSHI
2 patentsDENPATSU FLY ASH
2 patentsHIROSE NAOHIRO
1 patentKRAFT FOODS GLOBAL BRANDS LLC
1 patentKAMAKURA YOSHIMITSU
1 patentMILADINOV VESSELIN D
1 patentNIPPON PAINT CO LTD
1 patentMITSUBISHI ELECTRIC ENG
1 patentMITSUBISHI ELEC SYS LSI DESIGN
1 patentRENESAS ELECTRONICS CORP
1 patentFURUTANI TOSHIKI
1 patentINTERCONTINENTAL GREAT BRANDS LLC
1 patentUNIV TOKYO
1 patentShowing the top 50 of 51 patents by PatentIndex Score.