Inventor
HONG TU
US3 patents
Patents
3 patentsUS12565701B2Mar 3, 2026
Undercoating coverage and resistance control for ESCS of substrate processing systems
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US12500114B2Dec 16, 2025
Wafer lift pin mechanism for preventing local backside deposition
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US12014921B2Jun 18, 2024
Plasma enhanced wafer soak for thin film deposition
LAM RES CORP0 citations57