Inventor
AKAGAWA MASATOSHI
JP28 patents
⚠️ This page may combine multiple inventors who share the name “AKAGAWA MASATOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
26 patentsUS6590291B2Jul 8, 2003
Semiconductor device and manufacturing method therefor
SHINKO ELECTRIC IND CO197 citations99
US5918113AJun 29, 1999
Process for producing a semiconductor device using anisotropic conductive adhesive
SHINKO ELECTRIC IND CO200 citations99
US5677576AOct 14, 1997
Chip sized semiconductor device
SHINKO ELECTRIC IND CO177 citations99
US6121688ASep 19, 2000
Anisotropic conductive sheet and printed circuit board
SHINKO ELECTRIC IND CO107 citations98
US5834844ANov 10, 1998
Semiconductor device having an element with circuit pattern thereon
SHINKO ELECTRIC IND CO525 citations98
US5960308ASep 28, 1999
Process for making a chip sized semiconductor device
SHINKO ELECTRIC IND CO104 citations97
US6964887B2Nov 15, 2005
Method for manufacturing semiconductor device
SHINKO ELECTRIC IND CO50 citations96
US6759268B2Jul 6, 2004
Semiconductor device and manufacturing method therefor
SHINKO ELECTRIC IND CO58 citations96
US5886415AMar 23, 1999
Anisotropic conductive sheet and printed circuit board
SHINKO ELECTRIC IND CO73 citations96
US6255725B1Jul 3, 2001
IC card and plane coil for IC card
SHINKO ELECTRIC IND CO24 citations93
US7053475B2May 30, 2006
Semiconductor device and manufacturing method therefor
SHINKO ELECTRIC IND CO27 citations92
US5404273AApr 4, 1995
Semiconductor-device package and semiconductor device
SHINKO ELECTRIC IND CO46 citations92
US6380614B1Apr 30, 2002
Non-contact type IC card and process for manufacturing same
SHINKO ELECTRIC IND CO35 citations91
US6717249B2Apr 6, 2004
Non-contact type IC card and process for manufacturing-same
SHINKO ELECTRIC IND CO15 citations84
US6552694B1Apr 22, 2003
Semiconductor device and fabrication method thereof
SHINKO ELECTRIC IND CO15 citations84
US6469371B2Oct 22, 2002
Non-contact type IC card and process for manufacturing same
SHINKO ELECTRIC IND CO15 citations84
US6252777B1Jun 26, 2001
IC card and its frame
SHINKO ELECTRIC IND CO13 citations74
US7707713B2May 4, 2010
Component-embedded circuit board fabrication method
SHINKO ELECTRIC IND CO6 citations73
US7890203B2Feb 15, 2011
Wiring forming system and wiring forming method for forming wiring on wiring board
SHINKO ELECTRIC IND CO2 citations62
US7793412B2Sep 14, 2010
Component-embedded board fabrication method
SHINKO ELECTRIC IND CO3 citations62
US7495745B2Feb 24, 2009
Patterning method and computer readable medium therefor
SHINKO ELECTRIC IND CO2 citations62
US7303243B2Dec 4, 2007
Pattern drawing apparatus and pattern drawing method for forming patterns, that have mirror image relationship to each other with respect to a substrate, on both sides of the substrate, and test apparatus for use in the pattern drawing apparatus
SHINKO ELECTRIC IND CO3 citations62
US7179584B2Feb 20, 2007
Exposure method and device for forming patterns on printed wiring board
SHINKO ELECTRIC IND CO3 citations62
US7445965B2Nov 4, 2008
Method of manufacturing radiating plate and semiconductor apparatus using the same
SHINKO ELECTRIC IND CO4 citations59
US7307691B2Dec 11, 2007
Maskless direct exposure system and user interface
SHINKO ELECTRIC IND CO1 citations52
US7442477B2Oct 28, 2008
Exposing apparatus and exposing method, for maskless exposure of substrate to be exposed, and plotter and plotting method for directly plotting on object to be plotted
SHINKO ELECTRIC IND CO0 citations51