Inventor
ROBERTS CEREDIG
US36 patents
⚠️ This page may combine multiple inventors who share the name “ROBERTS CEREDIG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
35 patentsUS6204143B1Mar 20, 2001
Method of forming high aspect ratio structures for semiconductor devices
MICRON TECHNOLOGY INC130 citations98
US4987089AJan 22, 1991
BiCMOS process and process for forming bipolar transistors on wafers also containing FETs
MICRON TECHNOLOGY INC152 citations98
US5909630AJun 1, 1999
Dual-masked isolation
MICRON TECHNOLOGY INC54 citations96
US5789306AAug 4, 1998
Dual-masked field isolation
MICRON TECHNOLOGY INC64 citations96
US5573837ANov 12, 1996
Masking layer having narrow isolated spacings and the method for forming said masking layer and the method for forming narrow isolated trenches defined by said masking layer
MICRON TECHNOLOGY INC71 citations96
US5254218AOct 19, 1993
Masking layer having narrow isolated spacings and the method for forming said masking layer and the method for forming narrow isolated trenches defined by said masking layer
MICRON TECHNOLOGY INC85 citations95
US6258729B1Jul 10, 2001
Oxide etching method and structures resulting from same
MICRON TECHNOLOGY INC37 citations93
US6235639B1May 22, 2001
Method of making straight wall containers and the resultant containers
MICRON TECHNOLOGY INC19 citations93
US6103020AAug 15, 2000
Dual-masked field isolation
MICRON TECHNOLOGY INC16 citations93
US5861344AJan 19, 1999
Facet etch for improved step coverage of integrated circuit contacts
MICRON TECHNOLOGY INC36 citations93
US5730835AMar 24, 1998
Facet etch for improved step coverage of integrated circuit contacts
MICRON TECHNOLOGY INC32 citations93
US7687342B2Mar 30, 2010
Method of manufacturing a memory device
MICRON TECHNOLOGY INC22 citations92
US6190989B1Feb 20, 2001
Method for patterning cavities and enhanced cavity shapes for semiconductor devices
MICRON TECHNOLOGY INC32 citations92
US5732023AMar 24, 1998
SRAM cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC23 citations92
US5227321AJul 13, 1993
Method for forming MOS transistors
MICRON TECHNOLOGY INC43 citations89
US6531728B2Mar 11, 2003
Oxide etching method and structures resulting from same
MICRON TECHNOLOGY INC13 citations84
US6822342B2Nov 23, 2004
Raised-lines overlay semiconductor targets and method of making the same
MICRON TECHNOLOGY INC14 citations83
US5985767ANov 16, 1999
Facet etch for improved step coverage of integrated circuit contacts
MICRON TECHNOLOGY INC13 citations82
US5699292ADec 16, 1997
SRAM cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC13 citations82
US6693012B2Feb 17, 2004
Method and device to reduce gate-induced drain leakage (GIDL) current in thin gate oxide MOSFETs
MICRON TECHNOLOGY INC12 citations74
US6271073B1Aug 7, 2001
Method of forming transistors in a peripheral circuit of a semiconductor memory device
MICRON TECHNOLOGY INC6 citations74
US6040209AMar 21, 2000
Semiconductor memory device and method of forming transistors in a peripheral circuit of the semiconductor memory device
MICRON TECHNOLOGY INC8 citations74
US5844835ADec 1, 1998
SCRAM cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC3 citations74
US5844838ADec 1, 1998
SRAM cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC3 citations74
US5751630AMay 12, 1998
SRAM cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC6 citations74
US6914017B1Jul 5, 2005
Residue free overlay target
MICRON TECHNOLOGY INC10 citations73
US7935999B2May 3, 2011
Memory device
MICRON TECHNOLOGY INC2 citations63
US7247919B1Jul 24, 2007
Method and device to reduce gate-induced drain leakage (GIDL) current in thin gate oxides MOSFETs
MICRON TECHNOLOGY INC2 citations63
US6541809B1Apr 1, 2003
Method of making straight wall containers and the resultant containers
MICRON TECHNOLOGY INC3 citations63
US6252268B1Jun 26, 2001
Method of forming transistors in a peripheral circuit of a semiconductor memory device
MICRON TECHNOLOGY INC1 citations63
US5995411ANov 30, 1999
SRAM cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC1 citations63
US5943269AAug 24, 1999
SRAM cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC3 citations63
US5808941ASep 15, 1998
SRAM cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC5 citations63
US7488664B2Feb 10, 2009
Capacitor structure for two-transistor DRAM memory cell and method of forming same
MICRON TECHNOLOGY INC3 citations58
US5969994AOct 19, 1999
Sram cell employing substantially vertically elongated pull-up resistors
MICRON TECHNOLOGY INC0 citations52