Inventor

USENKO ALEXANDER

US8 patents

⚠️ This page may combine multiple inventors who share the name “USENKO ALEXANDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICON WAFER TECHNOLOGIES INC

3 patents

US6806171B1Oct 19, 2004

Method of producing a thin layer of crystalline material

SILICON WAFER TECHNOLOGIES INC310 citations95

US6696352B1Feb 24, 2004

Method of manufacture of a multi-layered substrate with a thin single crystalline layer and a versatile sacrificial layer

SILICON WAFER TECHNOLOGIES INC61 citations93

US6861320B1Mar 1, 2005

Method of making starting material for chip fabrication comprising a buried silicon nitride layer

SILICON WAFER TECHNOLOGIES INC16 citations82

SILICON WAFER TECHNOLOGIES

2 patents

US6344417B1Feb 5, 2002

Method for micro-mechanical structures

SILICON WAFER TECHNOLOGIES52 citations93

US6995075B1Feb 7, 2006

Process for forming a fragile layer inside of a single crystalline substrate

SILICON WAFER TECHNOLOGIES27 citations89

CORNING INC

1 patent

US8772875B2Jul 8, 2014

Semiconductor on glass substrate with stiffening layer

CORNING INC0 citations50

UNIV MISSOURI

1 patent

US12206030B2Jan 21, 2025

Stacked diode with side passivation and method of making the same

UNIV MISSOURI0 citations45

USENKO ALEXANDER

1 patent

US8796054B2Aug 5, 2014

Gallium nitride to silicon direct wafer bonding

USENKO ALEXANDER0 citations43