Inventor
CRANE JR STANFORD W
US60 patents
⚠️ This page may combine multiple inventors who share the name “CRANE JR STANFORD W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICON BANDWIDTH INC
21 patentsUS6905367B2Jun 14, 2005
Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same
SILICON BANDWIDTH INC107 citations97
US6307258B1Oct 23, 2001
Open-cavity semiconductor die package
SILICON BANDWIDTH INC38 citations96
US6461197B2Oct 8, 2002
Female contact pin including flexible contact portion
SILICON BANDWIDTH INC47 citations95
US6574726B2Jun 3, 2003
Modular architecture for high bandwidth computers
SILICON BANDWIDTH INC20 citations93
US6203347B1Mar 20, 2001
High-density electrical interconnect system
SILICON BANDWIDTH INC27 citations93
US6334794B1Jan 1, 2002
Electrical connector having staggered hold-down tabs
SILICON BANDWIDTH INC26 citations92
US6305987B1Oct 23, 2001
Integrated connector and semiconductor die package
SILICON BANDWIDTH INC32 citations92
US6247972B1Jun 19, 2001
Electrical connector assembly with a female electrical connector having internal flexible contact arm
SILICON BANDWIDTH INC17 citations92
US6078102AJun 20, 2000
Semiconductor die package for mounting in horizontal and upright configurations
SILICON BANDWIDTH INC34 citations92
US7070340B2Jul 4, 2006
High performance optoelectronic packaging assembly
SILICON BANDWIDTH INC20 citations91
US6663294B2Dec 16, 2003
Optoelectronic packaging assembly
SILICON BANDWIDTH INC43 citations91
US6421254B2Jul 16, 2002
Multi-chip module having interconnect dies
SILICON BANDWIDTH INC19 citations91
US6797882B1Sep 28, 2004
Die package for connection to a substrate
SILICON BANDWIDTH INC16 citations90
US6603193B2Aug 5, 2003
Semiconductor package
SILICON BANDWIDTH INC28 citations90
USD430565SSep 5, 2000
Computer cabinet
SILICON BANDWIDTH INC30 citations90
US7123465B2Oct 17, 2006
Decoupling capacitor for an integrated circuit and method of manufacturing thereof
SILICON BANDWIDTH INC30 citations88
US6700138B2Mar 2, 2004
Modular semiconductor die package and method of manufacturing thereof
SILICON BANDWIDTH INC27 citations86
US6847115B2Jan 25, 2005
Packaged semiconductor device for radio frequency shielding
SILICON BANDWIDTH INC13 citations82
US7183646B2Feb 27, 2007
Semiconductor chip carrier affording a high-density external interface
SILICON BANDWIDTH INC6 citations74
US6475832B2Nov 5, 2002
Open-cavity semiconductor die package
SILICON BANDWIDTH INC5 citations74
US6679733B2Jan 20, 2004
Electrical connector having electrically conductive shielding
SILICON BANDWIDTH INC9 citations73
PANDA PROJECT
15 patentsUS5543586AAug 6, 1996
Apparatus having inner layers supporting surface-mount components
PANDA PROJECT167 citations99
US5659953AAug 26, 1997
Method of manufacturing an apparatus having inner layers supporting surface-mount components
PANDA PROJECT45 citations96
US5637019AJun 10, 1997
Electrical interconnect system having insulative shrouds for preventing mismating
PANDA PROJECT86 citations96
US6016256AJan 18, 2000
Multi-chip module having interconnect dies
PANDA PROJECT44 citations94
US5822551AOct 13, 1998
Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board
PANDA PROJECT38 citations94
US5812797ASep 22, 1998
Computer having a high density connector system
PANDA PROJECT34 citations94
US5781408AJul 14, 1998
Computer system having a motorized door mechanism
PANDA PROJECT60 citations94
US5661631AAug 26, 1997
Computer system having color-coded printed circuit boards and corresponding slats
PANDA PROJECT24 citations93
US6050850AApr 18, 2000
Electrical connector having staggered hold-down tabs
PANDA PROJECT30 citations92
US6073229AJun 6, 2000
Computer system having a modular architecture
PANDA PROJECT22 citations91
US6031720AFeb 29, 2000
Cooling system for semiconductor die carrier
PANDA PROJECT47 citations91
US5576931ANov 19, 1996
Computer with two fans and two air circulation areas
PANDA PROJECT27 citations91
US5941617AAug 24, 1999
Decorative panel for computer enclosure
PANDA PROJECT34 citations90
US5951665ASep 14, 1999
Interface optimized computer system architecture
PANDA PROJECT34 citations89
US5791947AAug 11, 1998
Contact beam for electrical interconnect component
PANDA PROJECT7 citations74
(unassigned)
7 patentsUS5634821AJun 3, 1997
High-density electrical interconnect system
118 citations99
US5575688ANov 19, 1996
High-density electrical interconnect system
97 citations96
US5967850AOct 19, 1999
High-density electrical interconnect system
24 citations93
US5641309AJun 24, 1997
High-density electrical interconnect system
24 citations93
US6092139AJul 18, 2000
Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board
23 citations89
US6554651B2Apr 29, 2003
High-density electrical interconnect system
6 citations74
US5951320ASep 14, 1999
Electrical interconnect system with wire receiving portion
5 citations74
THE PANDA PROJECT
3 patentsQUANTUM LEAP PACKAGING INC
2 patentsCRANE ELECTRONICS
1 patentCRANE JR STANFORD W
1 patentShowing the top 50 of 60 patents by PatentIndex Score.