Inventor
CHUNG MYUNGKEE
KR10 patents
Patents
10 patentsUS11362054B2Jun 14, 2022
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11296004B2Apr 5, 2022
Semiconductor package including heat redistribution layers
SAMSUNG ELECTRONICS CO LTD4 citations71
US11581234B2Feb 14, 2023
Semiconductor package with improved heat dissipation
SAMSUNG ELECTRONICS CO LTD2 citations70
US12341074B2Jun 24, 2025
Semiconductor package with increased thermal dissipation
SAMSUNG ELECTRONICS CO LTD0 citations60
US12009328B2Jun 11, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11705418B2Jul 18, 2023
Semiconductor package with conductive bump on conductive post including an intermetallic compound layer
SAMSUNG ELECTRONICS CO LTD1 citations60
US12166013B2Dec 10, 2024
Semiconductor package, and a package on package type semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US11488937B2Nov 1, 2022
Semiconductor package with stack structure and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11430772B2Aug 30, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12154889B2Nov 26, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49